P95/P25

Polyimide-based Prepreg and Laminate

Download Data Sheet

Thermal PerformanceElectrical PerformanceIndustry Approvals
Tg
260°C
Td
416°C
Dk
3.76
Df
0.017
IPC-4101 - /40 /41
UL - File Number E41625
Isola offers a product line of polyimide-based prepreg (P25) and core material (P95) for high temperature printed circuit applications.

These products consist of an HB flammability rated polyimide resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. These products utilize a polyimide and thermoplastic blend resin, fully cured without the use of MDA (Methylenedianiline). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Performance Attributes
    • Lead-free assembly compatible
    • 6x 260°C reflow capable
  • Processing Advantages
    • Via filling capability
    • Multiple reflow capable
    • Multiple lamination cycles

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 125 mil (0.05 to 3.2 mm)
    • Available in full size sheet or panel form
  • Copper Foil Type
    • HTE Grade 3
    • RTF (Reverse Treat Foil)
  • Copper Weight
    • ½ to 3 oz (18 to 105 µm) available
    • Heavier copper available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass

Production & Manufacturing

  • This product is Available for Quick Turn Around
  • Currently manufactured in North America
PropertyTypical ValueUnitsTest Method
Metric (English)IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC260°C2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss416°C2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
60Minutes2.4.24.1
Z-Axis CTE
A. Pre-Tg
B. 50 to 260°C, (Total Expansion)
55
1.5
ppm/°C
%
2.4.24C
X/Y-Axis CTEPre-Tg13/14ppm/°C2.4.24C
Thermal Conductivity0.4W/mKASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
PassPass Visual2.4.13.1
Dk, Permittivity
A. @ 100 MHz
B. @ 500 MHz
C. @ 1 GHz
D. @ 2 GHz
E. @ 5 GHz
F. @ 10 GHz
3.83
3.80
3.78
3.76
3.73
3.73
2.5.5.9
2.5.5.9
2.5.5.9
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Df, Loss Tangent
A. @ 100 MHz
B. @ 500 MHz
C. @ 1 GHz
D. @ 2 GHz
E. @ 5 GHz
F. @ 10 GHz
0.0135
0.0151
0.0172
0.0179
0.0188
0.021
2.5.5.9
2.5.5.9
2.5.5.9
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Volume Resistivity
A. After moisture resistance
B. At elevated temperature
3.0 x 108
7.0 x 108
MΩ-cm2.5.17.1
Surface Resistivity
A. After moisture resistance
B. At elevated temperature
3.0 x 106
2.0 x 108
2.5.17.1
Dielectric Breakdown>55kV2.5.6B
Arc Resistance130Seconds2.5.1B
Electric Strength (Laminate & laminated prepreg)44 (1100)kV/mm (V/mil)2.5.6.2A
Comparative Tracking Index (CTI)2 (250-399)Class (Volts)UL 746A
ASTM D3638
Peel Strength
A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]
B. Standard profile copper
    1. After thermal stress
    2. At 125ºC (257ºF)
    3. After process solutions

1.14 (6.5)

1.25 (7.0)
1.25 (7.0)
1.14 (6.5)
N/mm (lb/inch)
2.4.8C

2.4.8.2A
2.4.8.3
2.4.8.3
Flexural Strength
A. Length direction
B. Cross direction
58,700
66,200
ksi2.4.4B
Tensile Strength
A. Length direction
B. Cross direction
54,540
36,111
ksiASTM D3039
Poisson's Ratio
A. Length direction
B. Cross direction
0.187
0.164
ASTM D3039
Moisture Absorption0.5%2.6.2.1A
Flammability (Laminate & laminated prepreg)HBRatingUL 94
Max Operating Temperature130°CUL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.
03/16/2017
03/16/2017
03/15/2017
02/23/2017
10/20/2014
12/31/2015
12/31/2015
10/29/2014

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