IS400
3.9 Dk , 0.02 Df
150 Tg , 330 Td
/101 /21 /24 /97 /99
IS400 laminate and prepreg is a temperature-resistant base material with Low Z-axis expansion
IS400 is based on a proprietary filled epoxy-system with a nominal glass transition temperature of approximately 150°C and a delamination time at 260°C of about 60 minutes. The Coefficient of Thermal Expansion (CTE) in the z-axis lies between room temperature and 120°C at 30 -40 ppm/K compared to unfilled systems at 60 – 70 ppm/K.
Key Features
High Thermal Performance
- Tg of 150°C (DSC)
- Td of 330°C (TGA)
CAF Resistant
- T260 ~ 60 mins
- T288 ~ 10 mins
- CTE 35 – 40 ppm/K RT – 150°C
Industry Approvals
- IPC-4101C /21 /24 /97 /99 /101
- UL E41625
Standard Availability
- Thickness: 0.002″ [.05 mm] to 0.093″ [2.4 mm]
- Available in sheet or panel form
- Copper Foil Cladding: Grade 3 (HTE), ½, 1 and 2 oz.
- Foil Options: Reverse treat
- Prepregs: Available in roll or panel form
- Glass Styles: Standard fabrics