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Products > IS400

IS400 Tg 150, Td 330
Dk 3.9, Df 0.02
/21 /24 /97 /99 /101

IS400 is a temperature-resistant base material with low Z-axis expansion.

This product is based on a proprietary filled epoxy-system with a nominal glass transition temperature of approximately 150ºC and a delamination time at 260ºC of about 60 minutes. The Coefficient of Thermal Expansion (CTE) in the Z-axis lies between room temperature and 150ºC at 40 ppm/K compared to unfilled systems at 60-70 ppm/K.

Key Features

High Thermal Performance

  • Tg of 150°C (DSC)
  • Td  of 330°C (TGA)
  • T260: 60 mins
  • T288: 10 mins
  • CTE 40 ppm/K, Room temperature to 150°C

CAF Resistant

Industry Approvals

  • IPC-4101D-WAM1 /21 /24 /97 /99 /101
  • UL  E41625

Standard Availability

  • Thickness: 0.002″ [.05 mm] to 0.093″ [2.4 mm]
    Available in sheet or panel form
  • Copper Foil Cladding: Grade 3 (HTE), ½, 1 and 2 oz.
  • Foil Options: Reverse treat
  • Prepregs: Available in roll or panel form
  • Glass Styles: Standard fabrics