IS410
Tg 180, Td 350
Dk 3.97, Df 0.02
/21 /24 /26 /28 /121 /124 /129
IS410 is a high-performance FR-4 epoxy laminate and prepreg system designed to support the printed circuit board industry’s requirements for higher levels of reliability and the trend to use lead‑free solder.
Isola’s IS410 has a glass transition temperature (Tg) of 180°C and is specially formulated for superior performance through multiple thermal excursions, passing 6X solder tests at 288°C. IS410 is optimized for enhanced drilling performance allowing high aspect ratio holes of ≤10 mils. Its unique resin chemistry provides CAF resistance with the benefit of long-term reliability of boards built with small feature designs.
Key Features
Industry Approvals
- IPC-4101C /21 /24 /26 /28 /121 /124 /129
- UL Recognized – FR-4, File Number E41625
High Thermal Performance
- Tg of 180°C (DSC)
- Superior performance through multiple thermal
- Excursions – Passes 6x @ 288°C
CAF Resistant
- Supports small feature size PCB designs
- Improves long-term circuit board reliability in the field
Enhanced Drilling Performance for High Aspect PTH
- Greater than 10 to 1 aspect ratio
- Optimized for drilling small holes (≤10 mils)
Standard Availability
- Thickness: 0.002″ [.05 mm] to 0.125″ [3.2 mm]
Available in sheet or panel form - Copper Foil Cladding: Grade 3 (HTE), 1⁄8 to 3 oz.
Heavyweight copper foils available on request (i.e. 4 oz., 5 oz. copper) - Foil Options: Double treat, reverse treat
- Prepregs: Available in roll or panel form
- Glass Styles: Available in most standard glass styles
