IS410

Lead-free Epoxy Laminate and Prepreg

Thermal PerformanceElectrical PerformanceIndustry Approvals
Tg
180°C
Td
350°C
Dk
3.97
Df
0.02
IPC-4101 - /21 /24 /26 /121 /124 /129
UL - File Number E41625
IS410 is a high-performance FR-4 epoxy laminate and prepreg system designed to support the printed circuit board industry’s requirements for higher levels of reliability and the trend to use lead‑free solder.

Isola’s IS410 has a glass transition temperature (Tg) of 180°C and is specially formulated for superior performance through multiple thermal excursions, passing 6X solder tests at 288°C. IS410 is optimized for enhanced drilling performance allowing high aspect ratio holes of ≤10 mils. Its unique resin chemistry provides CAF resistance with the benefit of long-term reliability of boards built with small feature designs.

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Performance Attributes
    • Lead-free assembly compatible
    • 6x 288°C solder float capable
  • Processing Advantages

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 125 mil (0.05 to 3.2 mm)
    • Available in full size sheet or panel form
  • Copper Foil Type
    • HTE Grade 3
    • RTF (Reverse Treat Foil)
  • Copper Weight
    • ½ to 2 oz (18 to 70 µm) available
    • Heavier copper available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass
    • Square weave glass

Production & Manufacturing

    PropertyTypical ValueUnitsTest Method
    Metric (English)IPC-TM-650 (or as noted)
    Glass Transition Temperature (Tg) by DSC180°C2.4.25C
    Decomposition Temperature (Td) by TGA @ 5% weight loss350°C2.4.24.6
    Time to Delaminate by TMA (Copper removed)
    A. T260
    B. T288
    50
    10
    Minutes2.4.24.1
    Z-Axis CTE
    A. Pre-Tg
    B. Post-Tg
    C. 50 to 260°C, (Total Expansion)
    55
    250
    3.5
    ppm/°C
    ppm/°C
    %
    2.4.24C
    2.4.24C
    X/Y-Axis CTEPre-Tg11ppm/°C2.4.24C
    Thermal Conductivity0.5W/mKASTM E1952
    Thermal Stress 10 sec @ 288ºC (550.4ºF)
    A. Unetched
    B. Etched
    PassPass Visual2.4.13.1
    Dk, Permittivity
    A. @ 100 MHz
    B. @ 1 GHz
    C. @ 2 GHz
    D. @ 5 GHz
    E. @ 10 GHz
    3.96
    3.90
    3.97
    3.87
    3.87
    2.5.5.3
    2.5.5.9
    Bereskin Stripline
    Bereskin Stripline
    Bereskin Stripline
    Df, Loss Tangent
    A. @ 100 MHz
    B. @ 1 GHz
    C. @ 2 GHz
    D. @ 5 GHz
    E. @ 10 GHz
    0.0149
    0.0189
    0.0200
    0.0230
    0.0230
    2.5.5.3
    2.5.5.9
    Bereskin Stripline
    Bereskin Stripline
    Bereskin Stripline
    Volume Resistivity
    A. After moisture resistance
    B. At elevated temperature
    8.0 x 108
    3.6 x 108
    MΩ-cm2.5.17.1
    Surface Resistivity
    A. After moisture resistance
    B. At elevated temperature
    8.0 x 106
    4.5 x 10(8)
    2.5.17.1
    Dielectric Breakdown>50kV
    Arc Resistance129Seconds
    Electric Strength (Laminate & laminated prepreg)44 (1100)kV/mm (V/mil)
    Comparative Tracking Index (CTI)3 (175-249)Class (Volts)UL 746A
    ASTM D3638
    Peel Strength
    A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]
    B. Standard profile copper
        1. After thermal stress
        2. At 125ºC (257ºF)
        3. After process solutions

    1.14 (6.5)

    1.225 (7.0)
    1.14 (6.5)
    0.90 (5.1)
    N/mm (lb/inch)
    2.4.8C

    2.4.8.2A
    2.4.8.3
    2.4.8.3
    Flexural Strength
    A. Length direction
    B. Cross direction
    82,600
    66,400
    2.4.4B
    Tensile Strength
    A. Length direction
    B. Cross direction
    60,890
    45,750
    ASTM D3039
    Poisson's Ratio
    A. Length direction
    B. Cross direction
    0.175
    0.143
    ASTM D3039
    Moisture Absorption0.20%2.6.2.1A
    Flammability (Laminate & laminated prepreg)V-0RatingUL 94
    Max Operating Temperature130°CUL 796
    The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.
    03/16/2017
    Material Safety Data Sheet
    02/23/2017
    Dk/Df Construction Table
    04/18/2017
    Laminate Data Sheet
    11/19/2015
    Material Safety Data Sheet
    10/17/2012
    Processing Guide

    Webinars, Videos & Articles

    Laminate & Prepreg Manufacturing (Presentation)

    This presentation describes the process of laminate and prepreg manufacturing.

    Material & Process Influences on Conductive Anodic Filamentation (CAF) (Presentation)

    This presentation describes how Bell Laboratories investigated the mechanism of CAF formation.

    If you have any questions about IS410, our pricing, or our support, or if you would like some general advice on using our materials, then please do call us or complete the form below. Your message will be routed directly to the product manager who will promptly reply to your inquiry.

    We thank you for your interest in IS410.

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