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This year’s Electronica fair in Munich started for us with a technology seminar. Augusto Meozzi, President Europe, invited technologists from Siemens and specialists from PCB industry to attend the seminar. Ray Sharpe, CEO Isola Group, presented an overview on global Isola activities.Subsequently Dr. Demmer,…

Metal Clad Substrates Metal Clad Substrates (MCS) are thermally conductive base materials for temperature-sensitive applications. The combination of a copper-clad dielectric and an aluminum carrier delivers effective heat dissipation and provide a great alternative to active cooling methods and thick film techniques. In addition to…

CHANDLER, ARIZONA, April 14, 2010 – On February 5, 2010, Isola USA Corp. and ITEQ Corp. signed a settlement agreement to end all litigation between the two companies. In the settlement agreement that has been designated highly confidential, ITEQ agreed to pay a royalty to…