370HRN

No-Flo® and Lo-Flo® Specialty Prepreg

Isola offers a 370HRN family of no-flow and low-flow prepregs consisting of proprietary resin systems specifically formulated for optimal performance in bonding applications requiring minimal resin flow and consistency in lamination.

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Thermal Performance

Tg: 180°C
Td: 340°C

Electrical Performance

Dk: 4.04
Df: 0.021

Industry Approvals

UL - TBD

370HRN products bring the fabricator specific thermal characteristics appropriate for use in multilayer rigid-flex applications.

Attributes

Asset 11

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
    • Lead-free assembly compatible
  • Processing Advantages
  • No-flow Prepreg
    • Adhesion to wide range of materials
    • Flex films – (Mylar®, Kapton®, etc.)
    • Treated or untreated copper
    • Plated metals (tin, solder, nickel, etc.)
    • Conventional laminate surfaces

Production & Manufacturing

Currently manufactured in Europe

Product Availability

  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass
Property Typical Value Units Test Method
Metric (English) IPC-TM-650 (or as noted)
Pressed Thickness
A. 106
B. 1080
C. 1080
0.049 (1.9)
0.064 (2.5)
0.076 (3.0)
 mm (mil) —
Resin Content
A. 106
B. 1080
C. 1080
71 ±2
60 ±2
65 ±2
 % —
Modified Circle Flow
A. 106
B. 1080
C. 1080
0.4 - 1.6 (15.7 - 63) / 1.6 - 3.0 (63 - 118)
0.4 - 1.6 (15.7 - 63)
0.4 - 1.6 (15.7 - 63) / 1.6 - 3.0 (63 - 118)
 mm (mil) 101-QA-WI-004339
Glass Transition Temperature (Tg) by DSC 180 °C 2.4.25C
Cure Temperature Recommended for Full Cure 188 °C —
Min. for Functional Bonding 163 °C —
Z-Axis CTE Pre-Tg 45 ppm/°C 2.4.24C
X/Y-Axis CTE Pre-Tg 13/14 ppm/°C 2.4.24C
Thermal Conductivity 0.40 W/m·K ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
 Pass Pass Visual 2.4.13.1
Electric Strength (Laminate & laminated prepreg) 53 (1350) kV/mm (V/mil) 2.5.6.2A
Peel Strength Standard profile copper >>> After thermal stress 1.23 (7.0) N/mm (lb/inch) 2.4.8C
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Revisions:
A: Initial release - 10/25

Resource Title & Summary Date Updated

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