Low Tg Laminate and Prepreg

DE104 offers excellent thermal resistance, due to its special resin system and a low coefficient of thermal expansion in the Z-axis.

Thermal Performance

Tg: 135°C
Td: 315°C

Electrical Performance

Dk: 4.37
Df: 0.022

Industry Approvals

IPC-4101 /21
UL - File Number E41625

The glass transition temperature (Tg) is 135°C (DSC). Time to delamination of the laminate at a temperature of 260°C is 12 minutes and the decomposition temperature (Td) is 315°C. The product is listed as FR-4 and can be processed using standard parameters. DE104 multilayer (ML) corresponds to NEMA-grade FR-4 and meets the requirements of IPC-4101D WAM1.



Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Performance Attributes
    • CAF resistant
    • Lead-free assembly compatible
  • Processing Advantages
    • FR-4 process compatible
    • UV blocking and AOI fluorescence

Production & Manufacturing

Currently manufactured in Europe

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 93 mil (0.05 to 2.4 mm)
    • Available in full size sheet or panel form
  • Copper Foil Type
    • HTE Grade 3
    • RTF (Reverse Treat Foil)
  • Copper Weight
    • ½ to 2 oz (18 to 70 µm) available
    • Heavier copper available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass
    • Square weave glass
    • Mechanically spread glass
Property Typical Value Units Test Method
Metric (English) IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC 135 °C 2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss 315 °C
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
Z-Axis CTE
A. Pre-Tg
B. Post-Tg
C. 50 to 260°C, (Total Expansion)
X/Y-Axis CTE Pre-Tg 16/13 ppm/°C 2.4.24C
Thermal Conductivity 0.36 W/m·K ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
Pass Pass Visual
Dk, Permittivity
A. @ 100 MHz
B. @ 500 MHz
C. @ 1 GHz
D. @ 2 GHz
E. @ 5 GHz
Df, Loss Tangent
A. @ 100 MHz
B. @ 500 MHz
C. @ 1 GHz
D. @ 2 GHz
E. @ 5 GHz
Volume Resistivity
A. C-96/35/90
B. After moisture resistance
C. At elevated temperature
1.3 x 106
3.4 x 107
Surface Resistivity
A. C-96/35/90
B. After moisture resistance
C. At elevated temperature
1.0 x 106
7.2 x 106
Dielectric Breakdown >50 kV 2.5.6B
Arc Resistance 105 Seconds 2.5.1B
Electric Strength (Laminate & laminated prepreg) 54 (1350) kV/mm (V/mil)
Comparative Tracking Index (CTI) 2 Class (Volts) UL 746A
ASTM D3638
Peel Strength
A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]
B. Standard profile copper
    1. After thermal stress
    2. At 125ºC (257ºF)
    3. After process solutions

1.23 (7.0)

1.58 (9.0)
1.23 (7.0)
1.58 (9.0)
N/mm (lb/inch)
Flexural Strength
A. Length direction
B. Cross direction
ksi 2.4.4B
Tensile Strength
A. Length direction
B. Cross direction
ksi ASTM D3039
Moisture Absorption 0.3 %
Flammability (Laminate & laminated prepreg) V-0 Rating UL 94
Relative Thermal Index (RTI) 130 °C UL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.


Visit our site for more details.
A: Initial release - 4/17
B; Correct 5GHz Df label - 8-17
C: Corrected units for Flexural and Tensile Strength - 8/18
D: Change MOT to RTI 5/19


Laminate & Prepreg Manufacturing

This presentation describes the process of laminate and prepreg manufacturing.

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Laminates, Prepreg, & PCB Materials
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