FR406N
FR406 No-Flo and
FR406 Lo-Flo® Specialty Prepreg
| Thermal Performance | Electrical Performance | Industry Approvals | ||
|---|---|---|---|---|
|
Tg 170°C |
Td 300°C |
Dk 4.3 |
Df 0.025 | UL - File Number E41625 |
Isola offers a FR406N family of no-flow and low-flow prepregs consisting of proprietary resin systems specifically formulated for optimal performance in bonding applications requiring minimal resin flow and consistency in lamination.
FR406 No-Flo and FR406 Lo-Flo® products bring the fabricator specific thermal characteristics appropriate for use in heat sink bonding, die cavity board (direct chip attachment) and multilayer rigid-flex applications.
Product Attributes
Typical Market Applications
Product Features
-
Industry Recognition
- RoHS Compliant
- Performance Attributes
-
Processing Advantages
- Machinable by steel rule die or punch
- Consistent dielectric spacing
- Complete encapsulation of non-planar surfaces
- Cure and form bond at low temperatures
- Allows for lamination at non-uniform pressures
-
No-flow Prepreg
- Adhesion to wide range of materials
- Flex films – (Mylar®, Kapton®, etc.)
- Treated or untreated copper
- Plated metals (tin, solder, nickel, etc.)
- Conventional laminate surfaces
Product Availability
- Standard Material Offering: Laminate
- Copper Foil Type
- Copper Weight
-
Standard Material Offering: Prepreg
- Roll or panel form
- Tooling of prepreg panels
-
Glass Fabric Availability
- E-glass
Production & Manufacturing
- Currently manufactured in Asia, North America, Europe
| Property | Typical Value | Units | Test Method | |
|---|---|---|---|---|
| Metric (English) | IPC-TM-650 (or as noted) | |||
| Pressed Thickness | A. 106 B. 1080 | 0.043 ±0.0008 (1.7 ±0.3) 0.069 ±0.0008 (2.7 ±0.3) | mm (mil) | |
| Resin Content | A. 106 B. 1080 | 65 ±1.5 | % | |
| Resin Flow Testing | A. 106 B. 1080 | R&R | — | 2.3.17 |
| Modified Circle Flow | A. 106 B. 1080 | 0.050-0.120 | — | |
| Glass Transition Temperature (Tg) by DSC | 170 | °C | 2.4.25C | |
| Cure Temperature Recommended for Full Cure | 185 | °C | ||
| Min. for Functional Bonding | 165 | °C | ||
| Z-Axis CTE | Post-Tg | 75 | ppm/°C | 2.4.24C |
| X/Y-Axis CTE | Pre-Tg | 17/20 | ppm/°C | 2.4.24C |
| Thermal Conductivity | .30 | W/mK | ASTM E1952 | |
| Thermal Stress 10 sec @ 288ºC (550.4ºF) | A. Unetched B. Etched | Pass | Pass Visual | 2.4.13.1 |
| Electric Strength (Laminate & laminated prepreg) | 1750 | kV/mm (V/mil) | 2.5.6.2A | |
| Peel Strength | Standard profile copper >>> After thermal stress | 10.0 | N/mm (lb/inch) | 2.4.8C |
| Flammability (Laminate & laminated prepreg) | V-0 | Rating | UL 94 | |
| The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold. | ||||
NOTE
Visit our site https://www.isola-group.com for more details.
Resource Title & Summary
Date Updated
10/10/2019
10/10/2019
12/04/2019
12/04/2019
Webinars, Videos & Articles
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We thank you for your interest in FR406N.