P96/P26

Polyimide-based Prepreg and Laminate

Download Data Sheet

Thermal PerformanceElectrical PerformanceIndustry Approvals
Tg
260°C
Td
396°C
Dk
3.76
Df
0.017
IPC-4101 /40 /41
UL - File Number E41625
Isola offers a product line of polyimide-based prepreg (P26) and core material (P96) for high temperature printed circuit applications.

These products consist of a flame resistant, polyimide resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. These products utilize a polyimide and thermoplastic blend resin, fully cured without the use of MDA (Methylenedianiline). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.

Typical Market Applications

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Performance Attributes
  • Processing Advantages

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 125 mil (0.05 to 3.2 mm)
    • Available in full size sheet or panel form
  • Copper Foil Type
    • HTE Grade 3
    • RTF (Reverse Treat Foil)
  • Copper Weight
    • ½ to 2 oz (18 to 70 µm) available
    • Heavier copper available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass

Production & Manufacturing

  • Currently manufactured in North America
PropertyTypical ValueUnitsTest Method
Metric (English)IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC260°C2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss396°C2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
60Minutes2.4.24.1
Z-Axis CTE
A. Pre-Tg
B. 50 to 260°C, (Total Expansion)
55
1.5
ppm/°C
%
2.4.24C
X/Y-Axis CTEPre-Tg13/14ppm/°C2.4.24C
Thermal Conductivity0.4W/mKASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
PassPass Visual2.4.13.1
Dk, Permittivity
A. @ 100 MHz
B. @ 500 MHz
C. @ 1 GHz
D. @ 2 GHz
E. @ 5 GHz
F. @ 10 GHz
3.83
3.80
3.78
3.76
3.73
3.73
2.5.5.9
2.5.5.9
2.5.5.9
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Df, Loss Tangent
A. @ 100 MHz
B. @ 500 MHz
C. @ 1 GHz
D. @ 2 GHz
E. @ 5 GHz
F. @ 10 GHz
0.0135
0.0151
0.0172
0.0179
0.0188
0.021
2.5.5.9
2.5.5.9
2.5.5.9
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Volume Resistivity
A. After moisture resistance
B. At elevated temperature
3.0 x 108
7.0 x 108
MΩ-cm2.5.17.1
Surface Resistivity
A. After moisture resistance
B. At elevated temperature
3 x 106
2 x 108
2.5.17.1
Dielectric Breakdown>55kV2.5.6B
Arc Resistance130Seconds2.5.1B
Electric Strength (Laminate & laminated prepreg)44 (1100)kV/mm (V/mil)2.5.6.2A
Comparative Tracking Index (CTI)4 (100-174)Class (Volts)UL 746A
ASTM D3638
Peel Strength
A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]
B. Standard profile copper
    1. After thermal stress
    2. At 125ºC (257ºF)
    3. After process solutions

1.14 (6.5)

1.25 (7.0)
1.25 (7.0)
1.14 (6.5)
N/mm (lb/inch)
2.4.8C

2.4.8.2A
2.4.8.3
2.4.8.3
Flexural Strength
A. Length direction
B. Cross direction
83.6
55.5
ksi2.4.4B
Tensile Strength
A. Length direction
B. Cross direction
55.5
35.4
ksiASTM D3039
Young's Modulus
A. Length direction
B. Cross direction
3958
3530
ksi
ASTM D790-15e2
Poisson's Ratio
A. Length direction
B. Cross direction
0.189
0.154
ASTM D3039
Moisture Absorption0.5%2.6.2.1A
Flammability (Laminate & laminated prepreg)V-0RatingUL 94
Relative Thermal Index (RTI)140°CUL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.
NOTE

Visit our site https://www.isola-group.com for more details.
Revisions:
A: Initial release - 4/17
B: Corrected units for Flexural and Tensile Strength - 8/18
C: Change MOT to RTI 5/19

Core Data

ConstructionResin Content %Thickness (inch)Thickness (mm)Dielectric Constant (DK) / Dissipation Factor (DF)
100 MHz500 MHz1 GHz2 GHz5 GHz10 Ghz
1x10670.0%Alternate0.00200.051
3.70
0.015
3.60
0.017
3.60
0.020
3.60
0.021
3.60
0.024
3.60
0.029
1x10674.0%Standard0.00250.064
3.60
0.016
3.60
0.018
3.50
0.020
3.50
0.021
3.50
0.025
3.50
0.030
1x108061.0%Standard0.00300.076
3.80
0.014
3.80
0.016
3.80
0.018
3.80
0.019
3.70
0.022
3.70
0.026
2x10666.0%Standard0.00350.089
3.70
0.015
3.70
0.016
3.70
0.019
3.70
0.020
3.60
0.023
3.60
0.028
1x211645.0%Standard0.00400.102
4.20
0.012
4.20
0.014
4.10
0.016
4.10
0.016
4.10
0.019
4.10
0.022
106/108058.0%Alternate0.00420.107
3.90
0.013
3.80
0.015
3.80
0.017
3.80
0.018
3.80
0.021
3.80
0.249
106/108062.0%Standard0.00450.114
3.80
0.014
3.80
0.016
3.80
0.018
3.80
0.019
3.70
0.022
3.70
0.026
106/108065.0%Alternate0.00500.127
3.80
0.014
3.70
0.016
3.70
0.019
3.70
0.020
3.70
0.023
3.70
0.027
2x108057.0%Standard0.00500.127
3.90
0.013
3.80
0.015
3.90
0.017
3.80
0.018
3.80
0.021
3.80
0.249
106/211353.0%Standard0.00530.135
4.00
0.013
4.00
0.015
3.90
0.017
3.90
0.017
3.90
0.020
3.90
0.024
106/211649.0%Standard0.00600.152
4.10
0.013
4.00
0.014
4.00
0.016
4.00
0.016
4.00
0.019
4.00
0.022
1080/211651.0%Standard0.00700.178
4.00
0.013
4.00
0.014
4.00
0.016
4.00
0.017
3.90
0.020
3.90
0.023
2113/211647.0%Standard0.00800.203
4.10
0.012
4.10
0.014
4.10
0.016
4.10
0.016
4.00
0.019
4.00
0.022
2113/211648.0%Standard0.00800.203
4.10
0.012
4.10
0.014
4.10
0.016
4.00
0.016
4.00
0.019
4.00
0.022
2x2113/10654.0%Standard0.00900.229
4.00
0.013
3.90
0.015
3.90
0.017
3.90
0.017
3.90
0.020
3.90
0.024
2x1080/211654.0%Standard0.01000.254
4.00
0.013
3.90
0.015
3.90
0.017
3.90
0.017
3.90
0.020
3.90
0.024
7628/2x108045.0%Standard0.01200.305
4.20
0.012
4.20
0.014
4.10
0.016
4.10
0.016
4.10
0.019
4.10
0.022
2x762839.0%Standard0.01400.356
4.30
0.011
4.30
0.012
4.20
0.014
4.20
0.014
4.20
0.017
4.20
0.019
2x7628/108042.0%Alternate0.01600.406
4.00
0.009
4.00
0.009
4.00
0.010
4.00
0.011
4.00
0.011
4.00
0.011
2x7628/211641.0%Alternate0.01800.457
4.10
0.009
4.10
0.009
4.00
0.010
4.00
0.011
4.00
0.011
4.00
0.011
2x2113/2x762842.0%Alternate0.02000.508
4.20
0.012
4.20
0.013
4.20
0.015
4.20
0.015
4.10
0.018
4.10
0.020
3x7628/211640.0%Alternate0.02400.610
4.30
0.011
4.20
0.012
4.20
0.014
4.20
0.015
4.20
0.017
4.20
0.020
4x762839.0%Standard0.02800.711
4.30
0.011
4.30
0.012
4.20
0.014
4.20
0.014
4.20
0.017
4.20
0.019
4x7628/211639.0%Standard0.03100.787
4.30
0.011
4.30
0.012
4.20
0.014
4.20
0.014
4.20
0.017
4.20
0.019
6x762836.0%Standard0.03900.991
4.30
0.010
4.30
0.012
4.30
0.013
4.30
0.014
4.30
0.016
4.30
0.018
1x2116/ 8x762838.0%Standard0.05901.499
4.30
0.011
4.30
0.012
4.30
0.014
4.30
0.014
4.20
0.017
4.20
0.019

Prepreg Data

Glass StyleResin Content %Thickness (inch)Thickness (mm)Dielectric Constant (DK) / Dissipation Factor (DF)
100 MHz500 MHz1 GHz2 GHz5 GHz10 Ghz
10675.0%0.00250.064
3.59
0.0156
3.55
0.0177
3.53
0.0205
3.50
0.0215
3.48
0.0255
3.48
0.0302
108065.0%0.00320.081
3.76
0.0144
3.72
0.0163
3.70
0.0187
3.67
0.0195
3.66
0.0231
3.66
0.0272
211357.0%0.00440.112
3.91
0.0135
3.87
0.0152
3.86
0.0173
3.83
0.0180
3.82
0.0211
3.82
0.0247
211654.0%0.00520.132
3.97
0.0132
3.93
0.0147
3.92
0.0167
3.89
0.0174
3.88
0.0203
3.88
0.0238
762842.0%0.00740.188
4.22
0.0115
4.19
0.0128
4.18
0.0145
4.17
0.0150
4.14
0.0175
4.14
0.0201
NOTE
Revisions:
A-Original-4/17
B-Modified construction offering 6/19
C-Corrected 31 mil core thickness 9/19
Standard-Commonly available with the best availability.
Alternate-Available, but not stocked with longer lead time
12/14/2016
10/20/2017
12/14/2016
12/14/2016
02/23/2017
10/20/2017
12/14/2016
07/06/2016

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