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Stack-up and routing optimization by understanding micro-scale PCB effects

Utilizing Thermal Fatigue Testing to Differentiate the Performance of Epoxy Materials at Various Glass Transition Temperature Levels

Thermal Reliability of Laser-ablated Microvias and Standard Through-Hole Technologies as a Function of Materials and Processing

The Effect of Processing, Glass Finish, and Rheology on the Interlaminar Shear Strength of a Woven e-Glass Reinforced Polymer Matrix Composite

The Compensation Problem and Solution Using Design of Experiments for Dense Multilayer Printed Circuit Boards

Standardizing a Test Method for Conductive Anodic Filament Growth Failure

Roughness Characterization for Interconnect Analysis

Re-engineered FR-4 Base Materials for Improved Multilayer PCB Performance

Process-specific PCB Thickness Modeling

Predicting Dimensional Deformation During Lamination- for Multilayer Printed Circuit Boards

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