Material & Process Influences On Conductive Anodic Filamentation
05 August 2016
Related Posts
Isola Shows Circuit Material Solutions for Hybrid Mixed-Signal Circuits at DMEMS2023
Isola Group brings the latest cost-effective, high-performance PCB material solutions for hybrid circuits to this year’s Del Mar Electronics & Manufacturing Show (DMEMS2023). With growing demand for miniaturization in electronic design, Isola’s materials support compact PCBs for RF/microwave (RF/MW), high-speed-digital (HSD), and power circuits…
Isola commercializes IS550H: Halogen Free, CAF resistant, high thermal reliability material
Isola Group, a leading global manufacturer of copper-clad laminates and dielectric prepregs for use in the manufacture of PCB, is launching our newest halogen free material called IS550H. IS550H is an environmentally friendly, extreme thermal reliability, CAF resistant copper clad laminate and prepreg material…
Check to select frequencies to calculate impedance. Check to highlight the copper layer of interest. Uncheck reference check box to designate a signal layer. By default, all layers are treated as a reference plane. 4. A ‘green’…