185HR

High-Tg, Low-CTE Materials with High Thermal Reliability

Download Data Sheet

Thermal PerformanceElectrical PerformanceIndustry Approvals
Tg
180°C
Td
340°C
Dk
4.01
Df
0.0200
IPC-4101 - /98 /99 /101 /126
UL - File Number E41625
185HR laminate and prepreg materials are a proprietary, high-performance resin system with a Tg of 180°C for multilayer Printed Wiring Board (PWB) applications where maximum thermal performance and reliability are required.

185HR laminate and prepreg materials are manufactured using Isola’s patented technology, reinforced with electrical grade (E-glass) glass fabric. This system delivers a 340°C decomposition temperature, a lower Z-axis expansion and offers lower loss compared to competitive products in this space. The 185HR system is also laser fluorescing and UV blocking for maximum compatibility with Automated Optical Inspection (AOI) systems, optical positioning systems and photoimageable solder mask imaging.

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • Qualified to UL’s MCIL Program
    • RoHS Compliant
  • Performance Attributes
    • CAF resistant
    • Lead-free assembly compatible
  • Processing Advantages
    • FR-4 process compatible
    • UV blocking and AOI fluorescence

Product Availability

  • Standard Material Offering: Laminate
  • Copper Foil Type
    • HTE Grade 3
    • RTF (Reverse Treat Foil)
  • Copper Weight
    • ½ to 2 oz (18 to 70 µm) available
    • Heavier copper available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass
    • Square weave glass

Production & Manufacturing

  • Currently manufactured in Asia, North America, Europe
PropertyTypical ValueUnitsTest Method
Metric (English)IPC-TM-650 (or as noted)
Test data generated from rigid laminateResin Content50%2.3.16.2
Glass Transition Temperature (Tg) by DSC180°C2.4.25C
Glass Transition Temperature (Tg) by DMA185°C2.4.24.4
Decomposition Temperature (Td) by TGA @ 5% weight loss340°C2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
60
>15
Minutes2.4.24.1
Z-Axis CTE
A. Pre-Tg
B. Post-Tg
C. 50 to 260°C, (Total Expansion)
40
220
2.7
ppm/°C
ppm/°C
%
2.4.24C
X/Y-Axis CTEPre-Tg13/14ppm/°C2.4.24C
Thermal Conductivity0.4W/mKASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
PassPass Visual2.4.13.1
Dk, Permittivity
A. @ 100 MHz
B. @ 1 GHz
C. @ 2 GHz
D. @ 5 GHz
E. @ 10 GHz
4.13
4.04
4.01
3.88
3.88
2.5.5.3
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Df, Loss Tangent
A. @ 100 MHz
B. @ 1 GHz
C. @ 2 GHz
D. @ 5 GHz
E. @ 10 GHz
0.0158
0.0192
0.0200
0.0235
0.0236
2.5.5.3
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Volume Resistivity
A. C-96/35/90
B. After moisture resistance
C. At elevated temperature
3.0 x 108
7.0 x 108
MΩ-cm2.5.17.1
Surface Resistivity
A. C-96/35/90
B. After moisture resistance
C. At elevated temperature
3.0 x 106
2.0 x 108
2.5.17.1
Dielectric Breakdown>50kV2.5.6B
Arc Resistance115Seconds2.5.1B
Electric Strength (Laminate & laminated prepreg)54 (1350)kV/mm (V/mil)2.5.6.2A
Comparative Tracking Index (CTI)3 (175-249)Class (Volts)UL 746A
ASTM D3638
Peel Strength
A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]
B. Standard profile copper
    1. After thermal stress
    2. At 125ºC (257ºF)
    3. After process solutions

0.969 (5.5)

1.06 (5.9)
1.06 (5.9)
0.969 (5.5)
N/mm (lb/inch)
2.4.8C

2.4.8.2A
2.4.8.3
2.4.8.3
Flexural Strength
A. Length direction
B. Cross direction
97,100
54,100
ksi2.4.4B
Tensile Strength
A. Length direction
B. Cross direction
53,337
35,678
ksiASTM D3039
Young's Modulus
A. Length direction
B. Cross direction
3770
3337
ksiASTM D790-15e2
Poisson's Ratio
A. Length direction
B. Cross direction
0.172
0.155
ASTM D3039
Moisture Absorption0.15%2.6.2.1A
Flammability (Laminate & laminated prepreg)V-0RatingUL 94
Max Operating Temperature130°CUL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

Core Data

ConstructionsResin Content %Standard/AlternateThickness (inch)Thickness (mm)Dielectric Constant (DK) / Dissipation Factor (DF)
100 MHz500 MHz1 GHz2 GHz5 GHz10 GHz
1 - 108060.0%Standard0.00250.0064
4.06
0.0164
3.98
0.0185
3.96
0.0201
3.93
0.021
3.81
0.0247
3.80
0.0248
1 - 106773.0%Alternate0.00250.0064
3.84
0.0184
3.77
0.021
3.74
0.0231
3.70
0.0241
3.55
0.0287
3.54
0.0289
1 - 108066.0%Standard0.0030.0076
3.96
0.0173
3.89
0.0197
3.86
0.0215
3.82
0.0224
3.68
0.0266
3.68
0.0267
1 - 108661.0%Alternate0.0030.0076
4.04
0.0166
3.97
0.0187
3.94
0.0204
3.91
0.0213
3.78
0.025
3.78
0.0252
1 - 331352.0%Alternate0.00350.0089
4.20
0.0152
4.13
0.017
4.11
0.0183
4.09
0.0191
3.97
0.0222
3.98
0.0223
1 - 211354.0%Standard0.00350.0089
4.19
0.0155
4.10
0.0174
4.07
0.0188
4.04
0.0195
3.92
0.0229
3.92
0.023
2-10668.0%Standard0.00350.0089
3.92
0.0136
3.88
0.0154
3.86
0.0177
3.84
0.0185
3.69
0.019
3.69
0.019
1 - 211648.0%Standard0.0040.0102
4.28
0.0145
4.21
0.0162
4.20
0.0175
4.18
0.0181
4.05
0.021
4.05
0.0211
1 - 331357.0%Alternate0.0040.0102
4.11
0.016
4.04
0.0179
4.03
0.0194
3.99
0.0203
3.86
0.0238
3.86
0.0238
2 - 10672.0%Standard0.0040.0102
3.86
0.0183
3.78
0.0208
3.76
0.0228
3.72
0.0238
3.57
0.0284
3.56
0.0285
1 - 211653.0%Standard0.00450.0114
4.18
0.0153
4.11
0.0172
4.10
0.0185
4.07
0.0193
3.94
0.0225
3.94
0.0226
106 / 108065.0%Alternate0.00450.0114
3.97
0.0172
3.90
0.0195
3.87
0.0213
3.84
0.0222
3.70
0.0262
3.70
0.0264
1 - 211657.0%Standard0.0050.0127
4.11
0.016
4.04
0.0179
4.03
0.0194
3.99
0.0203
3.86
0.0238
3.86
0.0238
2 - 108060.0%Standard0.0050.0127
4.06
0.0164
3.98
0.0185
3.96
0.0201
3.93
0.021
3.81
0.0247
3.80
0.0248
2 - 106773.0%Alternate0.0050.0127
3.84
0.0184
3.77
0.021
3.74
0.0231
3.70
0.0241
3.55
0.0287
3.54
0.0289
2 - 108063.0%Alternate0.00550.014
4.00
0.0169
3.93
0.0191
3.91
0.0208
3.87
0.0218
3.74
0.0257
3.74
0.0257
106 / 211360.0%Alternate0.00550.014
4.06
0.0164
3.98
0.0185
3.96
0.0201
3.93
0.021
3.81
0.0247
3.80
0.0248
1 - 165252.0%Standard0.0060.0152
4.20
0.0152
4.13
0.017
4.11
0.0183
4.09
0.0191
3.97
0.0222
3.98
0.0223
2 - 108065.0%Standard0.0060.0152
3.97
0.0172
3.90
0.0195
3.87
0.0213
3.84
0.0222
3.70
0.0262
3.70
0.0264
2 - 108661.0%Alternate0.0060.0152
4.04
0.0166
3.97
0.0187
3.94
0.0204
3.91
0.0213
3.78
0.025
3.78
0.0252
1 - 762843.0%Alternate0.0070.0178
4.38
0.0138
4.32
0.0152
4.31
0.0164
4.27
0.017
4.16
0.0196
4.15
0.0197
2 - 211354.0%Alternate0.0070.0178
4.19
0.0155
4.10
0.0174
4.07
0.0188
4.04
0.0195
3.92
0.0229
3.92
0.023
2 - 331352.0%Alternate0.0070.0178
4.20
0.0152
4.13
0.017
4.11
0.0183
4.09
0.0191
3.97
0.0222
3.98
0.0223
1 - 762846.0%Alternate0.00750.0191
4.32
0.0142
4.27
0.0158
4.24
0.017
4.21
0.0177
4.10
0.0204
4.10
0.0205
1 - 762848.0%Standard0.0080.0203
4.28
0.0145
4.21
0.0162
4.20
0.0175
4.18
0.0181
4.05
0.021
4.05
0.0211
2 - 211648.0%Standard0.0080.0203
4.28
0.0145
4.21
0.0162
4.20
0.0175
4.18
0.0181
4.05
0.021
4.05
0.0211
2 - 331357.0%Alternate0.0080.0203
4.11
0.016
4.04
0.0179
4.03
0.0194
3.99
0.0203
3.86
0.0238
3.86
0.0238
2 - 211653.0%Alternate0.0090.0229
4.18
0.0153
4.11
0.0172
4.10
0.0185
4.07
0.0193
3.94
0.0225
3.94
0.0226
2 - 211657.0%Standard0.010.0254
4.11
0.016
4.04
0.0179
4.03
0.0194
3.99
0.0203
3.86
0.0238
3.86
0.0238
2 - 165252.0%Standard0.0120.0305
4.20
0.0152
4.13
0.017
4.11
0.0183
4.09
0.0191
3.97
0.0222
3.98
0.0223
3 - 211648.0%Alternate0.0120.0305
4.28
0.0145
4.21
0.0162
4.20
0.0175
4.18
0.0181
4.05
0.021
4.05
0.0211
2 - 762843.0%Standard0.0140.0356
4.38
0.0138
4.32
0.0152
4.31
0.0164
4.27
0.017
4.16
0.0196
4.15
0.0197
2 - 762847.0%Standard0.0160.0406
4.33
0.0142
4.30
0.0158
4.28
0.017
4.26
0.0177
4.16
0.0204
4.16
0.0205
2 - 7628 / 211644.0%Standard0.0180.0457
4.36
0.0139
4.30
0.0154
4.29
0.0166
4.25
0.0172
4.14
0.0198
4.13
0.0199
3 - 762843.0%Standard0.0210.0533
4.38
0.0138
4.32
0.0152
4.31
0.0164
4.27
0.017
4.16
0.0196
4.15
0.0197
3 - 762845.0%Standard0.0240.061
4.31
0.0142
4.30
0.016
4.26
0.0175
4.24
0.0184
4.15
0.0218
4.15
0.0218
4 - 762843.0%Standard0.0280.0711
4.38
0.0138
4.32
0.0152
4.31
0.0164
4.27
0.017
4.16
0.0196
4.15
0.0197
4 - 762845.0%Standard0.0310.0787
4.31
0.0142
4.30
0.016
4.26
0.0175
4.24
0.0184
4.15
0.0218
4.15
0.0218
5 - 762843.0%Alternate0.0350.0889
4.38
0.0138
4.32
0.0152
4.31
0.0164
4.27
0.017
4.16
0.0196
4.15
0.0197
8 - 762843.0%Alternate0.0590.1499
4.38
0.0138
4.32
0.0152
4.31
0.0164
4.27
0.017
4.16
0.0196
4.15
0.0197

Prepreg Data

Glass StyleResin Content %Standard/AlternateThickness (inch)Thickness (mm)Dielectric Constant (DK) / Dissipation Factor (DF)
100 MHz500 MHz1 GHz2 GHz5 GHz10 GHz
106771.0%Alternate0.00230.058
3.88
0.014
3.84
0.016
3.82
0.018
3.79
0.019
3.65
0.019
3.65
0.019
10677.0%Standard0.00250.064
3.79
0.019
3.71
0.022
3.69
0.024
3.65
0.025
3.50
0.030
3.49
0.030
108664.0%Alternate0.00320.081
3.99
0.013
3.96
0.015
3.94
0.017
3.91
0.018
3.78
0.018
3.78
0.018
108067.0%Standard0.00320.081
3.94
0.018
3.86
0.020
3.84
0.022
3.78
0.023
3.66
0.027
3.66
0.027
108072.0%Alternate0.00390.099
3.86
0.018
3.78
0.021
3.76
0.023
3.72
0.024
3.57
0.028
3.56
0.029
211360.0%Standard0.00420.107
4.06
0.016
3.98
0.019
3.96
0.020
3.93
0.020
3.81
0.025
3.80
0.025
331360.0%Alternate0.00440.112
4.06
0.016
3.98
0.019
3.96
0.020
3.93
0.020
3.81
0.025
3.80
0.025
211657.0%Standard0.00510.130
4.11
0.016
4.04
0.018
4.03
0.019
3.99
0.020
3.86
0.024
3.86
0.024
165252.0%Alternate0.00600.152
4.20
0.015
4.13
0.017
4.11
0.018
4.09
0.019
3.97
0.022
3.98
0.022
762846.0%Standard0.00770.196
4.32
0.014
4.27
0.016
4.24
0.017
4.21
0.018
4.10
0.020
4.10
0.021
762849.0%Alternate0.00820.208
4.27
0.015
4.19
0.016
4.17
0.018
4.16
0.018
4.03
0.021
4.03
0.021
NOTE
"Standard" indicates available in all regions
Please Contact us for more details in below details.
Isola Group 3100 West Ray Road
Suite 301
Chandler, AZ 85226

Phone: 480-893-6527
Phone: 800-537-7656
Fax: 480-893-1409
11/02/2011
11/02/2011
07/05/2016

Webinars, Videos & Articles

Making Sense of Laminate Dielectric Properties (Technical Paper)

This paper highlights the critical selection factors that go beyond a typical product data sheet and explains how these factors must be considered when selecting materials for high speed applications.

Conductive Anodic Filament Growth Failure (Technical Paper)

This paper provides describes Isola's work in finding the right combination of process and design conditions for improved CAF resistant products.

Laminate & Prepreg Manufacturing (Presentation)

This presentation describes the process of laminate and prepreg manufacturing.

PCB Material Selection for High-speed Digital Designs (Presentation)

This presentation describes PCB factors that limit high-speed digital performance and the PCB material selection process and Isola product solutions.

If you have any questions about 185HR, our pricing, or our support, or if you would like some general advice on using our materials, then please do call us or complete the form below. Your message will be routed directly to the product manager who will promptly reply to your inquiry.

We thank you for your interest in 185HR.

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