IS400

Lead Free, Mid Tg Epoxy Laminate and Prepreg

IS400 is a proprietary, temperature resistant resin system with a Tg of 150°C.

Thermal Performance

Tg: 150°C
Td: 330°C

Electrical Performance

Dk: 3.90
Df: 0.022

Industry Approvals

IPC-4101 /97 /98 /99 /101
UL - File Number E41625

It is intended for multilayer Printed Wiring Board (PWB) applications where demanding thermal performance and high reliability are required. IS400 laminate and prepreg products are manufactured using Isola’s patented technology, reinforced with electrical grade (E-glass) glass fabric. This system delivers a 330°C decomposition temperature and a low Z-axis expansion.

Attributes

Markets

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Performance Attributes
    • CAF resistant
  • Processing Advantages
    • FR-4 process compatible

Production & Manufacturing

Currently manufactured in Asia, Europe

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 93 mil (0.05 to 2.4 mm)
    • Available in full size sheet or panel form
  • Copper Foil Type
    • HTE Grade 3
    • RTF (Reverse Treat Foil)
  • Copper Weight
    • ½ to 2 oz (18 to 70 µm) available
    • Heavier copper available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass
    • Square weave glass
Property Typical Value Units Test Method
Metric (English) IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC 150 °C 2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss 330 °C 2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
>60
>10
Minutes 2.4.24.1
Z-Axis CTE
A. Pre-Tg
B. Post-Tg
C. 50 to 260°C, (Total Expansion)
50
250
3.3
ppm/°C
ppm/°C
%
2.4.24C
2.4.24C
X/Y-Axis CTE Pre-Tg 13 ppm/°C 2.4.24C
Thermal Conductivity 0.36 W/m·K ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
Pass Pass Visual 2.4.13.1
Dk, Permittivity
A. @ 100 MHz
B. @ 500 MHz
4.00
3.90
2.5.5.3
2.5.5.9
Df, Loss Tangent
A. @ 100 MHz
B. @ 500 MHz
0.020
0.022
2.5.5.3
2.5.5.9
Volume Resistivity
A. C-96/35/90
B. At elevated temperature
4.0 x 108
7.0 x 107
MΩ-cm 2.5.17.1
Surface Resistivity
A. C-96/35/90
B. At elevated temperature
3.0 x 106
5.4 x 106
2.5.17.1
Dielectric Breakdown >50 kV 2.5.6B
Arc Resistance 120 Seconds 2.5.1B
Electric Strength (Laminate & laminated prepreg) 48 (1100) kV/mm (V/mil) 2.5.6.2A
Comparative Tracking Index (CTI) 3 (175-249) Class (Volts) UL 746A
ASTM D3638
Peel Strength
A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]
B. Standard profile copper
    1. After thermal stress
    2. At 125ºC (257ºF)
    3. After process solutions

1.05 (6.0)

1.45 (9.0)
1.25 (8.0)
1.45 (9.0)
N/mm (lb/inch)
2.4.8C

2.4.8.2A
2.4.8.3

2.4.8.2A
Flexural Strength
A. Length direction
B. Cross direction
82.0
66.6
ksi 2.4.4B
Tensile Strength
A. Length direction
B. Cross direction
51.2
41.7
ksi ASTM D3039
Young's Modulus
A. Length direction
B. Cross direction
3663
3328
ksi ASTM D790-15e2
Poisson's Ratio
A. Length direction
B. Cross direction
0.183
0.151
ASTM D3039
Moisture Absorption 0.18 % 2.6.2.1A
Flammability (Laminate & laminated prepreg) V-0 Rating UL 94
Relative Thermal Index (RTI) 130 °C UL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Visit our site http://www.isola-group.com for more details.
Revisions:
A: Initial release - 4/17
B: Corrected units for Flexural and Tensile Strength - 8/18
C: Change MOT to RTI 5/19

Core Data

Construction Resin Content % Thickness (inch) Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
100 MHz 500 MHz 1 Ghz 2 GHz 5 Ghz 10 Ghz
1x106 74.0% 0.002 0.051 3.91
0.0177
3.81
0.0200
3.80
0.0230
3.78
0.0240
3.72
0.0291
3.72
0.0292
1x1080 65.0% 0.003 0.076 4.03
0.0163
3.95
0.0185
3.91
0.0210
3.88
0.0222
3.82
0.0262
3.82
0.0263
1x2116 46.0% 0.004 0.102 4.45
0.0142
4.37
0.0159
4.39
0.0170
4.35
0.0182
4.32
0.0210
4.30
0.0211
1x2116 54.0% 0.005 0.127 4.21
0.0141
4.17
0.0158
4.15
0.0180
4.12
0.0187
4.06
0.0189
4.05
0.0191
1x1652 51.0% 0.006 0.152 4.28
0.0136
4.24
0.0152
4.22
0.0172
4.20
0.0179
4.14
0.0180
4.13
0.0182
1x7628 41.0% 0.007 0.178 4.58
0.0135
4.51
0.0149
4.52
0.0160
4.48
0.0164
4.45
0.0188
4.43
0.0189
1x7628 45.0% 0.008 0.203 4.48
0.0141
4.40
0.0156
4.42
0.0168
4.37
0.0181
4.35
0.0200
4.32
0.0201
2x2116 54.0% 0.010 0.254 4.21
0.0141
4.17
0.0158
4.15
0.0180
4.12
0.0187
4.06
0.0189
4.05
0.0191
2x1652 51.0% 0.012 0.305 4.28
0.0136
4.24
0.0152
4.22
0.0172
4.20
0.0179
4.14
0.0180
4.13
0.0182
2x7628 42.0% 0.014 0.356 4.55
0.0137
4.48
0.0152
4.49
0.0162
4.45
0.0177
4.42
0.0190
4.39
0.0191
2x7628 44.0% 0.015 0.381 4.50
0.0140
4.43
0.0155
4.44
0.0165
4.40
0.0171
4.37
0.0200
4.34
0.0201
2x7628 45.0% 0.016 0.406 4.48
0.0141
4.40
0.0156
4.42
0.0168
4.37
0.0181
4.35
0.0200
4.32
0.0201
2x7628/2116 41.0% 0.018 0.457 4.58
0.0135
4.51
0.0149
4.52
0.0160
4.48
0.0164
4.45
0.0188
4.43
0.0189
3x7628 41.0% 0.021 0.533 4.58
0.0135
4.51
0.0149
4.52
0.0160
4.48
0.0164
4.45
0.0188
4.43
0.0189
3x7628 45.0% 0.024 0.610 4.48
0.0141
4.40
0.0156
4.42
0.0168
4.37
0.0181
4.35
0.0200
4.32
0.0201
4x7628 41.0% 0.028 0.711 4.58
0.0135
4.51
0.0149
4.52
0.0160
4.48
0.0164
4.45
0.0188
4.43
0.0189
4x7628 44.0% 0.030 0.762 4.50
0.0140
4.43
0.0155
4.44
0.0165
4.40
0.0171
4.37
0.0200
4.34
0.0201
4x7628 45.0% 0.031 0.787 4.48
0.0141
4.40
0.0156
4.42
0.0168
4.37
0.0181
4.35
0.0200
4.32
0.0201
5x7628 41.0% 0.035 0.889 4.58
0.0135
4.51
0.0149
4.52
0.0160
4.48
0.0164
4.45
0.0188
4.43
0.0189
5x7628 44.0% 0.038 0.965 4.50
0.0140
4.43
0.0155
4.44
0.0165
4.40
0.0171
4.37
0.0200
4.34
0.0201
5x7628 45.0% 0.039 0.991 4.48
0.0141
4.40
0.0156
4.42
0.0168
4.37
0.0181
4.35
0.0200
4.32
0.0201
6x7628 41.0% 0.043 1.092 4.58
0.0135
4.51
0.0149
4.52
0.0160
4.48
0.0164
4.45
0.0188
4.43
0.0189
6x7628 45.0% 0.047 1.194 4.48
0.0141
4.40
0.0156
4.42
0.0168
4.37
0.0181
4.35
0.0200
4.32
0.0201
8x7628 41.0% 0.058 1.473 4.58
0.0135
4.51
0.0149
4.52
0.0160
4.48
0.0164
4.45
0.0188
4.43
0.0189
10x7628 44.0% 0.076 1.930 4.50
0.0140
4.43
0.0155
4.44
0.0165
4.40
0.0171
4.37
0.0200
4.34
0.0201
11x7628 44.0% 0.079 2.007 4.50
0.0140
4.43
0.0155
4.44
0.0165
4.40
0.0171
4.37
0.0200
4.34
0.0201
13x7628 41.0% 0.088 2.235 4.58
0.0135
4.51
0.0149
4.52
0.0160
4.48
0.0164
4.45
0.0188
4.43
0.0189
14x7628 41.0% 0.094 2.388 4.58
0.0135
4.51
0.0149
4.52
0.0160
4.48
0.0164
4.45
0.0188
4.43
0.0189
17x7628 41.0% 0.118 2.997 4.58
0.0135
4.51
0.0149
4.52
0.0160
4.48
0.0164
4.45
0.0188
4.43
0.0189
18x7628 41.0% 0.125 3.175 4.58
0.0135
4.51
0.0149
4.52
0.0160
4.48
0.0164
4.45
0.0188
4.43
0.0189

Prepreg Data

Glass Style Resin Content % Thickness (inch) Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
100 MHz 500 MHz 1 Ghz 2 GHz 5 Ghz 10 Ghz
106 74.0% 0.0023 0.058 3.91
0.0177
3.81
0.0200
3.80
0.0230
3.78
0.0240
3.72
0.0291
3.72
0.0292
1080 65.0% 0.0031 0.079 4.03
0.0163
3.95
0.0185
3.91
0.0210
3.88
0.0222
3.82
0.0262
3.82
0.0263
1080 69.0% 0.0035 0.089 3.97
0.0170
3.89
0.0192
3.86
0.0220
3.84
0.0232
3.77
0.0275
3.77
0.0277
2113 57.0% 0.0040 0.102 4.20
0.0161
4.11
0.0180
4.10
0.0200
4.08
0.0210
4.03
0.0240
4.02
0.0241
2116 53.0% 0.0047 0.119 4.30
0.0145
4.21
0.0163
4.20
0.0186
4.18
0.0194
4.13
0.0225
4.12
0.0226
2116 57.0% 0.0053 0.135 4.20
0.0161
4.11
0.0180
4.10
0.0200
4.08
0.0210
4.03
0.0240
4.02
0.0241
7628 46.0% 0.0079 0.201 4.45
0.0142
4.37
0.0159
4.39
0.0170
4.35
0.0182
4.32
0.0210
4.30
0.0211
7628 51.0% 0.0087 0.221 4.35
0.0143
4.26
0.0160
4.25
0.0181
4.23
0.0189
4.18
0.0220
4.17
0.0221

NOTE

Revisions:
A - Original Release - 4/17

Resources

Laminate & Prepreg Manufacturing

This presentation describes the process of laminate and prepreg manufacturing.

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Laminates, Prepreg, & PCB Materials
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