IS410

Lead-free Epoxy Laminate and Prepreg

IS410 is a high-performance FR-4 epoxy laminate and prepreg system designed to support the printed circuit board industry’s requirements for higher levels of reliability and the trend to use lead‑free solder.

Thermal Performance

Tg: 180°C
Td: 350°C

Electrical Performance

Dk: 3.97
Df: 0.0200

Industry Approvals

IPC-4101 /21 /24 /26 /121 /124 /129
UL - File Number E41625

Isola’s IS410 has a glass transition temperature (Tg) of 180°C and is specially formulated for superior performance through multiple thermal excursions, passing 6X solder tests at 288°C. IS410 is optimized for enhanced drilling performance allowing high aspect ratio holes of ≤10 mils. Its unique resin chemistry provides CAF resistance with the benefit of long-term reliability of boards built with small feature designs.

Attributes

Markets

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Performance Attributes
    • Lead-free assembly compatible
    • 6x 288°C solder float capable
  • Processing Advantages
    • FR-4 process compatible

Production & Manufacturing

Currently manufactured in Asia, Europe

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 125 mil (0.05 to 3.2 mm)
    • Available in full size sheet or panel form
  • Copper Foil Type
    • HTE Grade 3
    • RTF (Reverse Treat Foil)
  • Copper Weight
    • ½ to 2 oz (18 to 70 µm) available
    • Heavier copper available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass
    • Square weave glass
Property Typical Value Units Test Method
Metric (English) IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC 180 °C 2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss 350 °C 2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
50
10
Minutes 2.4.24.1
Z-Axis CTE
A. Pre-Tg
B. Post-Tg
C. 50 to 260°C, (Total Expansion)
55
250
3.5
ppm/°C
ppm/°C
%
2.4.24C
2.4.24C
X/Y-Axis CTE Pre-Tg 11 ppm/°C 2.4.24C
Thermal Conductivity 0.5 W/m·K ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
Pass Pass Visual 2.4.13.1
Dk, Permittivity
A. @ 100 MHz
B. @ 1 GHz
C. @ 2 GHz
D. @ 5 GHz
E. @ 10 GHz
3.96
3.90
3.97
3.87
3.87
2.5.5.3
2.5.5.9
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Df, Loss Tangent
A. @ 100 MHz
B. @ 1 GHz
C. @ 2 GHz
D. @ 5 GHz
E. @ 10 GHz
0.0149
0.0189
0.0200
0.0230
0.0230
2.5.5.3
2.5.5.9
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Volume Resistivity
A. After moisture resistance
B. At elevated temperature
8.0 x 108
3.6 x 108
MΩ-cm 2.5.17.1
Surface Resistivity
A. After moisture resistance
B. At elevated temperature
8.0 x 106
4.5 x 10(8)
2.5.17.1
Dielectric Breakdown >50 kV
Arc Resistance 129 Seconds
Electric Strength (Laminate & laminated prepreg) 44 (1100) kV/mm (V/mil)
Comparative Tracking Index (CTI) 3 (175-249) Class (Volts) UL 746A
ASTM D3638
Peel Strength
A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]
B. Standard profile copper
    1. After thermal stress
    2. At 125ºC (257ºF)
    3. After process solutions

1.14 (6.5)

1.225 (7.0)
1.14 (6.5)
0.90 (5.1)
N/mm (lb/inch)
2.4.8C

2.4.8.2A
2.4.8.3
2.4.8.3
Flexural Strength
A. Length direction
B. Cross direction
82.6
66.4
ksi 2.4.4B
Tensile Strength
A. Length direction
B. Cross direction
60.9
45.8
ksi ASTM D3039
Poisson's Ratio
A. Length direction
B. Cross direction
0.175
0.143
ASTM D3039
Moisture Absorption 0.20 % 2.6.2.1A
Flammability (Laminate & laminated prepreg) V-0 Rating UL 94
Relative Thermal Index (RTI) 130 °C UL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Visit our site http://www.isola-group.com for more details.
Revisions:
A: Initial release - 4/17
B: Corrected units for Flexural and Tensile Strength - 8/18
C: Change MOT to RTI 5/19

Core Data

Construction Resin Content % Thickness (inch) Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
100 MHz 500 MHz 1 Ghz 2 GHz 5 Ghz 10 GHz
1x106 70.0% 0.0020 0.051 3.59
0.0178
3.54
0.0203
3.51
0.0234
3.48
0.0240
3.40
0.0290
3.40
0.0290
1x1080 57.0% 0.0025 0.064 3.83
0.0158
3.79
0.0178
3.77
0.0205
3.74
0.0210
3.67
0.0250
3.67
0.0250
1x1080 63.0% 0.0030 0.076 3.71
0.0167
3.67
0.0189
3.65
0.0217
3.62
0.0230
3.54
0.0270
3.56
0.0270
1x2113 46.0% 0.0030 0.076 4.08
0.0141
4.04
0.0156
4.02
0.0177
3.99
0.0180
3.93
0.0210
3.93
0.0210
1x2113 51.0% 0.0035 0.089 3.96
0.0171
3.92
0.0193
3.90
0.0222
3.87
0.0230
3.81
0.0270
3.81
0.0270
2x106 65.0% 0.0035 0.089 3.68
0.0149
3.63
0.0166
3.61
0.0189
3.58
0.0200
3.50
0.0230
3.50
0.0230
1x2116 45.0% 0.0040 0.102 4.10
0.0139
4.06
0.0154
4.05
0.0175
4.02
0.0180
3.96
0.0210
3.96
0.0210
1x2116 49.0% 0.0043 0.109 4.01
0.0134
3.97
0.0149
3.95
0.0167
3.92
0.0170
3.86
0.0200
3.86
0.0200
106/1080 60.0% 0.0043 0.109 3.77
0.0163
3.73
0.0183
3.71
0.0210
3.68
0.0220
3.60
0.0260
3.60
0.0260
1x1652 42.0% 0.0050 0.127 4.17
0.0156
4.14
0.0176
4.12
0.0203
4.10
0.0210
4.04
0.0250
4.04
0.0250
106/2113 56.0% 0.0053 0.135 3.85
0.0152
3.81
0.0170
3.79
0.0194
3.76
0.0200
3.69
0.0240
3.69
0.0240
1080/2113 53.0% 0.0060 0.152 3.92
0.0133
3.88
0.0147
3.86
0.0165
3.83
0.0170
3.76
0.0200
3.76
0.0200
2113/2116 51.0% 0.0070 0.178 3.96
0.0150
3.92
0.0168
3.90
0.0191
3.87
0.0200
3.81
0.0230
3.81
0.0230
1x7628 41.0% 0.0070 0.178 4.20
0.0149
4.16
0.0166
4.15
0.0189
4.12
0.0200
4.07
0.0230
4.07
0.0230
2x2116 45.0% 0.0080 0.203 4.10
0.0139
4.06
0.0154
4.05
0.0175
4.02
0.0180
3.96
0.0210
3.96
0.0210
2x1080/2116 47.0% 0.0100 0.254 4.05
0.0142
4.01
0.0158
4.00
0.0179
3.97
0.0190
3.91
0.0220
3.91
0.0220
2x1652 42.0% 0.0100 0.254 4.17
0.0134
4.14
0.0149
4.12
0.0167
4.10
0.0170
4.04
0.0200
4.04
0.0200
2x1080/7628 47.0% 0.0120 0.305 4.05
0.0142
4.01
0.0158
4.00
0.0179
3.97
0.0190
3.91
0.0220
3.91
0.0220
2x7628 42.0% 0.0140 0.356 4.17
0.0134
4.14
0.0149
4.12
0.0167
4.10
0.0170
4.04
0.0200
4.04
0.0200
2x7628/2116 42.0% 0.0180 0.457 4.17
0.0134
4.14
0.0149
4.12
0.0167
4.10
0.0170
4.04
0.0200
4.04
0.0200
3x7628 40.0% 0.0210 0.533 4.22
0.0131
4.19
0.0145
4.17
0.0163
4.18
0.0170
4.11
0.0200
4.11
0.0200

Prepreg Data

Glass Style Resin Content % Thickness (inch) Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
100 MHz 500 MHz 1 Ghz 2 GHz 5 Ghz 10 GHz
106 75.0% 0.0023 0.058 3.50
0.0186
3.45
0.0212
3.46
0.0246
3.39
0.0260
3.30
0.0310
3.30
0.0310
1080 65.0% 0.0030 0.076 3.68
0.0171
3.63
0.0193
3.61
0.0222
3.58
0.0230
3.50
0.0275
3.50
0.0275
2113 57.0% 0.0039 0.099 3.83
0.0158
3.79
0.0178
3.77
0.0203
3.74
0.0210
3.67
0.0250
3.67
0.0250
2116 56.0% 0.0050 0.127 3.85
0.0156
3.81
0.0176
3.79
0.0205
3.76
0.0210
3.69
0.0250
3.69
0.0250
7628 44.0% 0.0074 0.188 4.12
0.0137
4.09
0.0153
4.07
0.0172
4.04
0.0180
3.98
0.0210
3.98
0.0210

NOTE

Revisions:
A - Original Release - 4/17

Resources

Laminate & Prepreg Manufacturing

This presentation describes the process of laminate and prepreg manufacturing.

Material & Process Influences on Conductive Anodic Filamentation (CAF)

This presentation describes how Bell Laboratories investigated the mechanism of CAF formation.

Contact Our Team For Product Information

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