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Isola will exhibit at SMT Hybrid Packaging 2013, April 16-19th in Nuremberg, Germany. SMT Hybrid Packaging is Europe’s leading event on System Integration in Micro Electronics. In today’s rapidly evolving electronics market, technology leaders such as Isola, must continually…

Isola Introduces Halogen-Free, Ultra-Low Loss Materials for High-Speed Digital, RF and Microwave Applications New TerraGreen™ laminates and prepreg materials for multilayer PCBs are ideal for high-layer count, high-speed digital, backplanes and hybrid designs. CHANDLER, Ariz., September 25, 2013 — Isola Group S.à.r.l., a market leader in copper-clad…

JANUARY 29, 2002 – Isola Laminate Systems, a business unit of Isola AG, the world’s leader in base materials for electronic interconnect, introduces IS410 a high-performance FR-4 epoxy laminate & prepreg system designed to support the printed circuit board industry’s requirements for higher levels of…