Networking & Communication Systems
Isola helps connect with world with highly reliable and thermally robust materials.
As bandwidth becomes a more pressing issue in networking and communications systems PCB materials play an increasingly critical component. OEMs serving these markets turn to Isola for its high performance requirements and reliability of laminates that meet the highest quality demands for video, voice and satellite services and other data-intensive applications where bandwidth is an issue. Isola partners with leaders across these varied markets where manufacturers of high-speed network equipment, satellite transmission systems, mobile computing and wireless networks must adhere to extremely stringent internal procedures and standardized test vehicles for qualifying laminates. Isola materials are engineered for the most demanding environments and systems.
| Product | CTE Z-axis | Tg by TMA | Td | Dk | Df |
|---|---|---|---|---|---|
| Tachyon® 100G | 2.5 | 200 | 360 | 3.02 | 0.0021 |
| IS300MD | 2.9 | 190 | 390 | 3.20 | 0.0033 |
| 185HR | 2.7 | 180 | 340 | 4.01 | 0.0200 |
| FR408HR | 2.8 | 190 | 360 | 3.68 | 0.0092 |
| TerraGreen® | 2.9 | 200 | 390 | 3.44 | 0.0039 |
| I-Tera® MT40 | 2.8 | 200 | 360 | 3.45 | 0.0031 |
| I-Speed® | 2.7 | 180 | 360 | 3.64 | 0.0060 |
| FR408 | 3.5 | 180 | 360 | 3.67 | 0.0120 |
| 370HR | 2.8 | 180 | 340 | 4.04 | 0.0210 |
| IS410 | 3.5 | 180 | 350 | 3.97 | 0.02 |
Webinars, Videos & Articles
This presentation discusses Printed Circuit Board (PCB) attributes for RF, microwave, millimeter-wave systems through an application example using an advanced automotive safety system.
This paper discusses a new enabling technology which employs a thermoset matrix that has very good adhesion to metals, enabling the use of copper with extremely smooth surfaces.
This paper discusses how new thermoset resins are emerging as a viable alternative for advanced automotive safety systems by offering cost and reliability advantages over
This paper discusses how substrate integrated waveguides (SIWs) mimic the behavior of rectangular waveguides (RWGs) and can be implemented with standard PCB technology.
This paper focuses on new laminate materials with potential uses in multilayer printed circuit boards (PCBs) for high-speed digital/RF/microwave applications.
This article outlines the challenges for lead-free designs with demanding signal integrity requirements while managing cost constraints and dispels the perception that signal integrity material challenges only exist with very high-speed applications, requiring long transmission lines.
This presentation discusses thermal management considerations for embedded systems.
This paper provides describes Isola's work in finding the right combination of process and design conditions for improved CAF resistant products.
This paper discusses laser and plasma ablatable dielectric materials, available as coatings on copper.
This paper discusses how for 28-56 Gb/s design the homogeneous isotropic material assumption is a key impediment in model to measurement correlation.
This paper describes the regulations and lead-free materials and processes, base material properties and presents test data that highlights the importance of specific properties that should be considered when selecting materials for lead-free applications.
This paper discusses the continuing evolution of FR-4 base materials.
This paper discusses new technologies presenting results of PCB fabrication techniques for these materials as well as the benefits to the end users.
This paper presents the design, implementation and measurement of a high efficient GaN-HEMT power amplifier working at 2.4 GHz.
This article discusses how non-dicyandiamide FR-4 stacks up under Telecordia GR-78 insulation and degradation tests.
This presentation describes the sources & physical mechanisms of PIM in communication systems.
This presentation describes PCB factors that limit high-speed digital performance and the PCB material selection process and Isola product solutions.
This application note addresses the mechanical issues of this technology, when it is used on thicker boards.