Material & Process Influences On Conductive Anodic Filamentation

Material & Process Influences On Conductive Anodic Filamentation

05 August 2016

Related Posts

Circuit Materials Fit Into 5g Microcells AP
Packing mmWave Circuits into 5G Microcells
Fifth Generation (5G) wireless cellular networks promise performance that will meet every mobile user’s need, including reliable voice service, fast data, and steady video links. But such achievements will not come overnight, and they will call for a 5G network infrastructure with more cell sites…
ASTRA SOCIAL Astra MT77 product
Astra®MT77 – PTFE Performance without the Hassle!
Isola’s Astra MT77 product enables RF/MW designers to get similar electrical performance traditionally associated with ceramic-filled PTFE systems. The laminate material is a tightly controlled and very low dielectric constant of 3.0, an ultra-low dissipation factor of 0.0017, as well as using the very…
IMS Promo 2 2022
PCB Materials Pave the Way to Faster, Higher-Frequency Circuits
  Designers looking to trim losses, size, and weight from high-speed, high-frequency printed-circuit boards (PCBs) will want to visit Isola Group in Booth #5090 at IMS2022. There, the company will display an array of its advanced circuit materials, which are formulated for low…