370HR

High Performance Laminate and Prepreg Materials

Thermal PerformanceElectrical PerformanceIndustry Approvals
Tg
180°C
Td
340°C
Dk
4.04
Df
0.0210
IPC-4101 - /101 /98 /99 /126
UL - File Number E41625
370HR is the industry’s “best in class” lead-free compatible product for high-reliability applications across the telecommunications and high-end automotive markets.

370HR is a high performance 180°C glass transition temperature (Tg) FR-4 system for multilayer Printed Wiring Board (PWB) applications where maximum thermal performance and reliability are required.

370HR laminate and prepreg products are manufactured with a unique high performance multifunctional expoxy resin, reinforced with electrical grade (E-glass) glass fabric. This system provides improved thermal performance and low expansion rates in comparison to traditional FR-4 while retaining FR-4 processability.

In addition to this superior thermal performance, the mechanical, chemical and moisture resistance properties all equal or exceed the performance of traditional FR-4 materials. The 370HR system is also laser fluorescing and UV blocking for maximum  compatibility with Automated Optical Inspection (AOI) systems, optical positioning systems with photoimagable solder mask imaging.

370HR has proven to be best in class for sequential lamination designs.

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • Qualified to UL’s MCIL Program
    • RoHS Compliant
  • Performance Attributes
    • CAF resistant
  • Processing Advantages
    • FR-4 process compatible
    • UV blocking and AOI fluorescence

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 125 mil (0.05 to 3.2 mm)
    • Available in full size sheet or panel form
  • Copper Foil Type
    • HTE Grade 3
    • RTF (Reverse Treat Foil)
  • Copper Weight
    • ½ to 2 oz (18 to 70 µm) available
    • Heavier copper available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass
    • Square weave glass
    • Mechanically spread glass

Production & Manufacturing

  • Currently manufactured in Asia, North America, Europe
PropertyTypical ValueUnitsTest Method
Metric (English)IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC180°C2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss340°C2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
60
30
Minutes2.4.24.1
Z-Axis CTE
A. Pre-Tg
B. Post-Tg
C. 50 to 260°C, (Total Expansion)
45
230
2.8
ppm/°C
ppm/°C
%
2.4.24C
X/Y-Axis CTEPre-Tg13/14ppm/°C2.4.24C
Thermal ConductivityW/mKASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
PassPass Visual2.4.13.1
Dk, Permittivity
A. @ 100 MHz
B. @ 1 GHz
C. @ 2 GHz
D. @ 5 GHz
E. @ 10 GHz
4.24
4.17
4.04
3.92
3.92
2.5.5.3
2.5.5.9
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Df, Loss Tangent
A. @ 100 MHz
B. @ 1 GHz
C. @ 2 GHz
D. @ 5 GHz
E. @ 10 GHz
0.0150
0.0161
0.0210
0.0250
0.0250
2.5.5.3
2.5.5.9
Bereskin Stripline
2.5.5.5
2.5.5.5
Volume Resistivity
A. After moisture resistance
B. At elevated temperature
3.0 x 108
7.0 x 108
MΩ-cm2.5.17.1
Surface Resistivity
A. After moisture resistance
B. At elevated temperature
3.0 x 106
2.0 x 108
2.5.17.1
Dielectric Breakdown>50kV2.5.6B
Arc Resistance115Seconds2.5.1B
Electric Strength (Laminate & laminated prepreg)54 (1350)kV/mm (V/mil)2.5.6.2A
Comparative Tracking Index (CTI)3 (175-249)Class (Volts)UL 746A
ASTM D3638
Peel Strength
A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]
B. Standard profile copper
    1. After thermal stress
    2. At 125ºC (257ºF)
    3. After process solutions

1.14 (6.5)

1.25 (7.0)
1.25 (7.0)
1.14 (6.5)
N/mm (lb/inch)
2.4.8C

2.4.8.2A
2.4.8.3
2.4.8.3
Flexural Strength
A. Length direction
B. Cross direction
90,000
77,000
2.4.4B
Tensile Strength
A. Length direction
B. Cross direction
55,900
35,620
ASTM D3039
Poisson's Ratio
A. Length direction
B. Cross direction
0.177
0.171
ASTM D3039
Moisture Absorption0.15%2.6.2.1A
Flammability (Laminate & laminated prepreg)V-0RatingUL 94
Max Operating Temperature130°CUL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.
02/23/2017
Dk/Df Construction Table
04/18/2017
Laminate Data Sheet
11/19/2015
Material Safety Data Sheet
07/30/2013
Processing Guide

Webinars, Videos & Articles

New Solution for Addressing Glass Stop in PCB Stack Ups (Technical Paper)

This paper discusses how the use of heavy copper in printed circuit boards for high voltage applications is on the rise in the automotive and power management systems industries.

Making Sense of Laminate Dielectric Properties (Technical Paper)

This paper highlights the critical selection factors that go beyond a typical product data sheet and explains how these factors must be considered when selecting materials for high speed applications.

Conductive Anodic Filament Growth Failure (Technical Paper)

This paper provides describes Isola's work in finding the right combination of process and design conditions for improved CAF resistant products.

Laminate & Prepreg Manufacturing (Presentation)

This presentation describes the process of laminate and prepreg manufacturing.

PCB Material Selection for High-speed Digital Designs (Presentation)

This presentation describes PCB factors that limit high-speed digital performance and the PCB material selection process and Isola product solutions.

If you have any questions about 370HR, our pricing, or our support, or if you would like some general advice on using our materials, then please do call us or complete the form below. Your message will be routed directly to the product manager who will promptly reply to your inquiry.

We thank you for your interest in 370HR.

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