Astra® MT77

Ultra Low Loss, RF/MW Laminate and Prepreg

Astra® MT77 materials are a breakthrough, very low-loss dielectric constant (Dk) product for millimeter wave frequencies and beyond.

Thermal Performance

Tg: 200°C
Td: 360°C

Electrical Performance

Dk: 3.00
Df: 0.0017

Industry Approvals

IPC-4103 /17
UL - File Number E41625

Astra MT77 laminate materials exhibit exceptional electrical properties which are very stable over a broad frequency and temperature range. Astra MT77 is suitable for many of today’s commercial RF/microwave printed circuit designs. It features a dielectric constant (Dk) that is stable between -40°C and +140°C at up to W-band frequencies. In addition, Astra MT77 offers an ultra-low dissipation factor (Df) of 0.0017, making it a cost-effective alternative to PTFE and other commercial microwave laminate materials.

Key applications include long antennas and radar applications for automobiles, such as adaptive cruise control, pre-crash, blind spot detection, lane departure warning and stop and go systems.

Attributes

Markets

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Performance Attributes
    • Lead-free assembly compatible
  • Processing Advantages
    • FR-4 process compatible
    • Short lamination cycle
    • Reduced drill wear
    • No plasma desmear required
    • Good flow and fill
    • Dimensional stability
    • Multiple lamination cycles
    • Any layer technology compatible
    • HDI technology compatible
    • VIPPO design compatible

Production & Manufacturing

Currently manufactured in Europe

Product Availability

  • Standard Material Offering: Laminate
    • 2.5, 5, 7.5, 10, 12.5, 15, 20, 30, 60 mil ( 0.0635, 0.127, 0.1905, 0.254, 0.3175, 0.381, 0.510, 0.760, 1.50 mm)
  • Copper Foil Type
    • VLP-2 (2 micron), 1 oz and below
  • Copper Weight
    • ⅓, ½, 1 oz (12, 18 and 35 µm) available
    • Heavier copper available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels
Property Typical Value Units Test Method
Metric (English) IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC 200 °C 2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss 360 °C 2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
>60 Minutes 2.4.24.1
Z-Axis CTE
A. Pre-Tg
B. Post-Tg
50 - 70
250 - 350
ppm/°C 2.4.24C
X/Y-Axis CTE Pre-Tg 12 ppm/°C 2.4.24C
Thermal Conductivity 0.45 W/m·K ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
Pass Pass Visual 2.4.13.1
Dk, Permittivity
A. @ 2 GHz
B. @ 10 GHz
3.00 2.5.5.5
Df, Loss Tangent
A. @ 2 GHz
B. @ 10 GHz
0.0017 Bereskin Stripline
Volume Resistivity C-96/35/90 1.33 x 107 MΩ-cm 2.5.17.1
Surface Resistivity C-96/35/90 1.33 x 105 2.5.17.1
Dielectric Breakdown 45.4 kV 2.5.6B
Arc Resistance 139 Seconds 2.5.1B
Electric Strength (Laminate & laminated prepreg) 45 (1133) kV/mm (V/mil) 2.5.6.2A
Comparative Tracking Index (CTI) 3 (175-249) Class (Volts) UL 746A
ASTM D3638
Peel Strength 1 oz. EDC foil 1.0 (5.7) N/mm (lb/inch) 2.4.8.3
Flexural Strength
A. Length direction
B. Cross direction
49.0
39.0
ksi 2.4.4B
Tensile Strength
A. Length direction
B. Cross direction
31.0
24.0
ksi ASTM D3039
Poisson's Ratio
A. Length direction
B. Cross direction
0.183
0.182
ASTM D3039
Moisture Absorption 0.1 % 2.6.2.1A
Flammability (Laminate & laminated prepreg) V-0 Rating UL 94
Relative Thermal Index (RTI) 130 °C UL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Visit our site http://www.isola-group.com for more details.
Revisions:
A: Initial release - 4/17
B: Corrected units for Flexural and Tensile Strength - 8/18
C: Change MOT to RTI 5/19

Core Data

Standard/ Alternate Thickness (inch) Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
2 GHz 5 GHz 10 GHz 15 GHz 20 GHz
Standard 0.0025 0.064 3.00
0.0017
3.00
0.0017
3.00
0.0017
3.00
0.0017
3.00
0.0017
Standard 0.0050 0.127 3.00
0.0017
3.00
0.0017
3.00
0.0017
3.00
0.0017
3.00
0.0017
Standard 0.0075 0.191 3.00
0.0017
3.00
0.0017
3.00
0.0017
3.00
0.0017
3.00
0.0017
Standard 0.0100 0.254 3.00
0.0017
3.00
0.0017
3.00
0.0017
3.00
0.0017
3.00
0.0017
Standard 0.0120 0.305 3.00
0.0017
3.00
0.0017
3.00
0.0017
3.00
0.0017
3.00
0.0017
Standard 0.0150 0.381 3.00
0.0017
3.00
0.0017
3.00
0.0017
3.00
0.0017
3.00
0.0017
Standard 0.0200 0.508 3.00
0.0017
3.00
0.0017
3.00
0.0017
3.00
0.0017
3.00
0.0017
Standard 0.0300 0.762 3.00
0.0017
3.00
0.0017
3.00
0.0017
3.00
0.0017
3.00
0.0017
Standard 0.0600 1.524 3.00
0.0017
3.00
0.0017
3.00
0.0017
3.00
0.0017
3.00
0.0017

Prepreg Data

Glass Style Resin Content % Standard/ Alternate Thickness (inch) Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
2 GHz 5 Ghz 10 Ghz 15 Ghz 20 Ghz
1035 73.0% Alternate 0.0025 0.064 2.97
0.0019
2.97
0.0019
2.97
0.0019
2.97
0.0019
2.97
0.0019
1067 72.0% Standard 0.0025 0.064 2.98
0.0019
2.98
0.0019
2.98
0.0019
2.98
0.0019
2.98
0.0019
1067 77.0% Standard 0.0032 0.081 2.91
0.0018
2.91
0.0018
2.91
0.0018
2.91
0.0018
2.91
0.0018
1078 70.0% Standard 0.0036 0.091 3.01
0.0019
3.01
0.0019
3.01
0.0019
3.01
0.0019
3.01
0.0019
1078 74.0% Standard 0.0042 0.107 2.95
0.0019
2.95
0.0019
2.95
0.0019
2.95
0.0019
2.95
0.0019

NOTE

Revisions:
A-Original-4/17
B-Added Standard & Alternate construction-8/18

Standard-Commonly available with the best availability.
Alternate-Available, but not stocked with longer lead time

Resources

PCB Material Selection for RF, Microwave and Millimeter-wave Design

This presentation discusses Printed Circuit Board (PCB) attributes for RF, microwave, millimeter-wave systems through an application example using an advanced automotive safety system.

New Thermoset PCB Materials Improve Millimeter Wave Performance and Reliability at Reduced Cost

This presentation discusses the following: - Printed Circuit Board (PCB) - Requirements for Operation in mmWave Frequency Band - Requirements for Automotive Safety Systems - Available Materials - Case Study: Automotive RADAR

Laminate & Prepreg Manufacturing

This presentation describes the process of laminate and prepreg manufacturing.

Enabling Lower Cost Advanced Automotive Safety Systems Through Hybrid PCB Construction

This presentation describes Printed Circuit Board (PCB) requirements for advanced automotive safety systems; hybrid PCB construction and benefits and material availability.

Thermosets’ Cost and Reliability Advantages for Automotive Radar PCBs

This paper discusses how new thermoset resins are emerging as a viable alternative for advanced automotive safety systems by offering cost and reliability advantages over

Conductive Anodic Filament Growth Failure

This paper provides describes Isola's work in finding the right combination of process and design conditions for improved CAF resistant products.