RF / Microwave
Isola helps designers achieve smaller, more powerful and durable and less power hungry products.
Today’s RF, microwave and millimeter wave designers are challenged more than ever with the task of achieving an optimal balance between cost and performance when selecting base materials. Key factors include precise control of dielectric thickness, dielectric constant and dissipation factor, achieving lowest tolerance within a batch as well as batch-to-batch. To achieve controlled impedance and consistent electrical performance, along the lines of amplitude and phase response, RF high-frequency designs require extremely precise controls on dielectric constant, line widths and dielectric thickness. If any one of these three factors is changed, variations will be seen in the performance of the circuit. As frequencies increase, designers are looking to controlled dielectric materials as a means of achieving optimal signal performance. This would include the designers also paying closer attention to the selection of copper foils such as VLP-2 (very low profile 2 micron), as well as woven glass styles such as square weave or spread glass styles that would also help improve overall performance and ease of PCB manufacturing.
|IS680 AG -348||N/A||200||360||3.48||0.0029|
|I-Tera® MT40 (RF/MW)||N/A||200||360||3.38 / 3.45 / 3.60 / 3.75||0.0028 - 0.0035|
|IS680 AG||N/A||200||360||3.00 / 3.38 / 3.45 / 3.48||0.0020 - 0.0029|
Webinars, Videos & Articles
This presentation discusses Printed Circuit Board (PCB) attributes for RF, microwave, millimeter-wave systems through an application example using an advanced automotive safety system.
This paper discusses a new enabling technology which employs a thermoset matrix that has very good adhesion to metals, enabling the use of copper with extremely smooth surfaces.
This paper discusses how substrate integrated waveguides (SIWs) mimic the behavior of rectangular waveguides (RWGs) and can be implemented with standard PCB technology.
This paper focuses on new laminate materials with potential uses in multilayer printed circuit boards (PCBs) for high-speed digital/RF/microwave applications.
This presentation discusses thermal management considerations for embedded systems.