High Performance Laminate and Prepreg

Thermal PerformanceElectrical PerformanceIndustry Approvals
IPC-4101 - /98 /99 /101 /126
UL - File Number E41625
I-Speed® is a proprietary high performance 180°C glass transition temperature (Tg) FR-4 system for multilayer Printed Wiring Board (PWB) applications where maximum thermal performance and reliability are required.

I-Speed® laminate and prepreg products are manufactured with Isola’s patentable high performance multifunctional resin system, reinforced with electrical grade (E-glass) glass fabric. This system delivers a 15% improvement in Z-axis expansion and offers 25% more electrical bandwidth (lower loss) than competitive products in this space. These properties coupled with superior moisture resistance at reflow, result in a product that bridges the gap from both a thermal and electrical perspective.

I-Speed® is also available with low Dk glass fabric. The low Dk glass significantly reduces the Dk of the material to 3.30, allowing increased trace widths and also reduces skew caused by Dk differences between the glass and resin. The I-Speed® system is laser fluorescing and UV blocking for maximum compatibility with Automated Optical Inspection (AOI) systems, optical positioning systems and photoimagable solder mask imaging.

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • Qualified to UL’s MCIL Program
    • RoHS Compliant
  • Performance Attributes
    • Lead-free assembly compatible
  • Processing Advantages
    • FR-4 process compatible
    • UV blocking and AOI fluorescence

Product Availability

  • Standard Material Offering: Laminate
    • Available in full size sheet or panel form
  • Copper Foil Type
    • HTE Grade 3
    • VLP-2 (2 micron), 1 oz and below
    • RTF (Reverse Treat Foil)
  • Copper Weight
    • ½ to 2 oz (18 to 70 µm) available
    • Heavier copper available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass
    • Low Dk glass
    • Square weave glass
    • Mechanically spread glass

Production & Manufacturing

    PropertyTypical ValueUnitsTest Method
    Metric (English)IPC-TM-650 (or as noted)
    Glass Transition Temperature (Tg) by DSC180°C2.4.25C
    Decomposition Temperature (Td) by TGA @ 5% weight loss360°C2.4.24.6
    Time to Delaminate by TMA (Copper removed)
    A. T260
    B. T288
    Z-Axis CTE
    A. Pre-Tg
    B. Post-Tg
    C. 50 to 260°C, (Total Expansion)
    X/Y-Axis CTEPre-Tg16ppm/°C2.4.24C
    Thermal Conductivity0.4W/mKASTM E1952
    Thermal Stress 10 sec @ 288ºC (550.4ºF)
    A. Unetched
    B. Etched
    PassPass Visual2.4.13.1
    Dk, Permittivity
    A. @ 1 GHz
    B. @ 2 GHz
    C. @ 5 GHz
    D. @ 10 GHz
    Bereskin Stripline
    Bereskin Stripline
    Bereskin Stripline
    Df, Loss Tangent
    A. @ 1 GHz
    B. @ 2 GHz
    C. @ 5 GHz
    D. @ 10 GHz
    Bereskin Stripline
    Bereskin Stripline
    Bereskin Stripline
    Volume Resistivity
    A. After moisture resistance
    B. At elevated temperature
    4.4 x 107
    9.4 x 107
    Surface Resistivity
    A. After moisture resistance
    B. At elevated temperature
    2.6 x 106
    2.1 x 108
    Dielectric Breakdown>50kV2.5.6B
    Arc Resistance137Seconds2.5.1B
    Electric Strength (Laminate & laminated prepreg)70 (1741)kV/mm (V/mil)
    Comparative Tracking Index (CTI)3 (175-249)Class (Volts)UL 746A
    ASTM D3638
    Peel Strength
    A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]
    B. Standard profile copper
        1. After thermal stress
        2. After process solutions

    1.14 (6.5)

    0.96 (5.5)
    0.90 (5.1)
    N/mm (lb/inch)
    Flexural Strength
    A. Length direction
    B. Cross direction
    Tensile Strength
    A. Length direction
    B. Cross direction
    ASTM D3039
    Poisson's Ratio
    A. Length direction
    B. Cross direction
    ASTM D3039
    Moisture Absorption0.061%
    Flammability (Laminate & laminated prepreg)V-0RatingUL 94
    Max Operating Temperature130°CUL 796
    The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.
    Material Safety Data Sheet
    Dk/Df Construction Table
    Dk/Df Construction Table
    Laminate Data Sheet
    Material Safety Data Sheet
    Processing Guide

    Webinars, Videos & Articles

    Making Sense of Laminate Dielectric Properties (Technical Paper)

    This paper highlights the critical selection factors that go beyond a typical product data sheet and explains how these factors must be considered when selecting materials for high speed applications.

    Laminate & Prepreg Manufacturing (Presentation)

    This presentation describes the process of laminate and prepreg manufacturing.

    Quantifying Timing Skew In Differential Signaling using Practical Fiber Weave Model (Presentation)

    This presentation outlines practical fiber weave effect model for skew and jitter.

    PCB Material Selection for High-speed Digital Designs (Presentation)

    This presentation describes PCB factors that limit high-speed digital performance and the PCB material selection process and Isola product solutions.

    Modelling Skew and Jitter Induced by Fiber Weave Effect in PCB Dielectrics (Presentation)

    This presentation describes a practical fiber-weave effect model to mitigate skew.

    If you have any questions about I-Speed, our pricing, or our support, or if you would like some general advice on using our materials, then please do call us or complete the form below. Your message will be routed directly to the product manager who will promptly reply to your inquiry.

    We thank you for your interest in I-Speed.

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