FR408HR

High Performance Laminate and Prepreg

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Thermal PerformanceElectrical PerformanceIndustry Approvals
Tg
190°C
Td
360°C
Dk
3.68
Df
0.0092
IPC-4101 /98 /99 /101 /126
UL - File Number E41625
FR408HR is a proprietary high-performance 230°C (DMA) glass transition temperature (Tg) FR-4 system for multilayer Printed Wiring Board (PWB) applications where maximum thermal performance and reliability are required.

FR408HR laminate and prepreg products are manufactured with Isola’s patented high performance multifunctional resin system, reinforced with electrical grade (E-glass) glass fabric. This system delivers a 30% improvement in Z-axis expansion and offers 25% more electrical bandwidth (lower loss) than competitive products in this space. These properties coupled with superior moisture resistance at reflow, result in a product that bridges the gap from both a thermal and electrical perspective.

The FR408HR system is also laser fluorescing and UV blocking for maximum compatibility with Automated Optical Inspection (AOI) systems, optical positioning systems and photo-imagable solder mask imaging.

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Performance Attributes
    • CAF resistant
    • Lead-free assembly compatible
    • 0.8 mm pitch capable
    • 6x 260°C reflow capable
    • 6x 288°C solder float capable
  • Processing Advantages
    • UV blocking and AOI fluorescence
    • Via filling capability
    • Multiple lamination cycles

Product Availability

  • Standard Material Offering: Laminate
    • Available in full size sheet or panel form
  • Copper Foil Type
    • HTE Grade 3
    • VLP-2 (2 micron), 1 oz and below
    • RTF (Reverse Treat Foil)
  • Copper Weight
    • ½ to 2 oz (18 to 70 µm) available
    • Heavier copper available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass
    • Square weave glass
    • Mechanically spread glass

Production & Manufacturing

  • This product is Available for Quick Turn Around
  • Currently manufactured in Asia, North America, Europe
PropertyTypical ValueUnitsTest Method
Metric (English)IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC190°C2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss360°C2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
60
>30
Minutes2.4.24.1
Z-Axis CTE
A. Pre-Tg
B. Post-Tg
C. 50 to 260°C, (Total Expansion)
55
230
2.8
ppm/°C
ppm/°C
%
2.4.24C
X/Y-Axis CTEPre-Tg16ppm/°C2.4.24C
Thermal Conductivity0.4W/mKASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
PassPass Visual2.4.13.1
Dk, Permittivity
A. @ 100 MHz
B. @ 1 GHz
C. @ 2 GHz
D. @ 5 GHz
E. @ 10 GHz
3.72
3.69
3.68
3.64
3.65
2.5.5.3
2.5.5.9
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Df, Loss Tangent
A. @ 100 MHz
B. @ 1 GHz
C. @ 2 GHz
D. @ 5 GHz
E. @ 10 GHz
0.0072
0.0091
0.0092
0.0098
0.0095
2.5.5.3
2.5.5.9
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Volume Resistivity
A. After moisture resistance
B. At elevated temperature
4.4 x 107
9.4 x 107
MΩ-cm2.5.17.1
Surface Resistivity
A. After moisture resistance
B. At elevated temperature
2.6 x 106
2.1 x 108
2.5.17.1
Dielectric Breakdown>50kV2.5.6B
Arc Resistance137Seconds2.5.1B
Electric Strength (Laminate & laminated prepreg)70 (1741)kV/mm (V/mil)2.5.6.2A
Comparative Tracking Index (CTI)3 (175-249)Class (Volts)UL 746A
ASTM D3638
Peel Strength
A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]
B. Standard profile copper
    1. After thermal stress
    2. After process solutions

1.14 (6.5)

0.96 (5.5)
0.90 (5.1)
N/mm (lb/inch)
2.4.8C

2.4.8.2A
2.4.8.3
Flexural Strength
A. Length direction
B. Cross direction
72.5
58.0
ksi2.4.4B
Tensile Strength
A. Length direction
B. Cross direction
54.5
38.7
ksiASTM D3039
Young's Modulus
A. Length direction
B. Cross direction
3695
3315
ksiASTM D790-15e2
Poisson's Ratio
A. Length direction
B. Cross direction
0.137
0.133
ASTM D3039
Moisture Absorption0.061%2.6.2.1A
Flammability (Laminate & laminated prepreg)V-0RatingUL 94
Max Operating Temperature130°CUL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.
NOTE

Visit our site https://www.isola-group.com for more details.
Revisions:

A: Original Post

B: Corrected units for Flexural and Tensile Strength

C: Removed Low Dk glass option

Core Data

ConstructionResin Content %
Standard/Alternate
Thickness (inch)Thickness (mm)Dielectric Constant (DK) / Dissipation Factor (DF)
100 MHz500 MHz1 GHz2 GHz5 GHz10 Ghz
1x10672.0%Standard0.00200.051
3.37
0.0075
3.36
0.0089
3.34
0.0096
3.32
0.0101
3.30
0.0107
3.30
0.0107
1x108057.0%Standard0.00250.064
3.67
0.0071
3.64
0.0079
3.62
0.0089
3.61
0.0092
3.60
0.0097
3.59
0.0095
1x106769.0%Alt/Spread0.00250.064
3.42
0.0075
3.40
0.0084
3.38
0.0095
3.36
0.0100
3.34
0.0105
3.33
0.0104
1x108063.0%Standard0.00300.076
3.54
0.0074
3.52
0.0082
3.50
0.0092
3.48
0.0096
3.47
0.0102
3.47
0.0101
1x108658.0%Alt/Spread0.00300.076
3.65
0.0072
3.63
0.0079
3.60
0.0091
3.59
0.0092
3.57
0.0098
3.57
0.0095
2x10667.0%Standard0.00350.089
3.46
0.0074
3.45
0.0083
3.42
0.0094
3.40
0.0098
3.38
0.0104
3.37
0.0102
1x331351.0%Standard0.00350.089
3.82
0.0068
3.79
0.0076
3.77
0.0084
3.77
0.0087
3.74
0.0092
3.74
0.0090
1x106/1x108059.0%Standard0.00400.102
3.63
0.0072
3.61
0.0080
3.58
0.0090
3.57
0.0093
3.55
0.0098
3.54
0.0096
1x331355.0%Standard0.00400.102
3.72
0.0071
3.70
0.0077
3.68
0.0087
3.66
0.0090
3.65
0.0095
3.65
0.0094
1x106/1x108061.0%Alternate0.00430.109
3.57
0.0073
3.56
0.0081
3.54
0.0092
3.52
0.0095
3.51
0.0099
3.50
0.0098
1x211650.0%Standard0.00450.114
3.82
0.0068
3.81
0.0075
3.80
0.0083
3.79
0.0086
3.78
0.0091
3.76
0.0089
1x106/1x108062.0%Standard0.00450.114
3.55
0.0073
3.54
0.0082
3.52
0.0092
3.50
0.0095
3.48
0.0100
3.48
0.0098
2x106769.0%Alt/Spread0.00500.127
3.42
0.0075
3.40
0.0084
3.38
0.0095
3.36
0.0100
3.34
0.0105
3.33
0.0104
2x108057.0%Standard0.00500.127
3.67
0.0071
3.64
0.0079
3.62
0.0089
3.61
0.0092
3.60
0.0097
3.59
0.0095
1x211654.0%Standard0.00500.127
3.72
0.0070
3.71
0.0077
3.70
0.0086
3.69
0.0089
3.67
0.0095
3.67
0.0093
2x108058.0%Standard0.00550.140
3.65
0.0072
3.63
0.0079
3.60
0.0091
3.59
0.0092
3.57
0.0098
3.57
0.0095
2x108658.0%Alt/Spread0.00600.152
3.65
0.0072
3.63
0.0079
3.60
0.0091
3.59
0.0092
3.57
0.0098
3.57
0.0095
1x165250.0%Standard0.00600.152
3.82
0.0068
3.81
0.0075
3.80
0.0083
3.79
0.0086
3.78
0.0091
3.76
0.0089
2x331350.0%Standard0.00700.178
3.82
0.0068
3.81
0.0075
3.80
0.0083
3.79
0.0086
3.78
0.0091
3.76
0.0089
2x331355.0%Standard0.00800.203
3.72
0.0071
3.70
0.0077
3.68
0.0087
3.66
0.0090
3.65
0.0095
3.65
0.0094
2x211654.0%Standard0.01000.254
3.72
0.0070
3.71
0.0077
3.70
0.0086
3.69
0.0089
3.67
0.0095
3.67
0.0093
2x165242.0%Standard0.01000.254
4.02
0.0065
4.01
0.0072
3.99
0.0080
3.98
0.0083
3.97
0.0088
3.96
0.0085
3x331355.0%Standard0.01200.305
3.72
0.0071
3.70
0.0077
3.68
0.0087
3.66
0.0090
3.65
0.0095
3.65
0.0094
1x1080/2x165249.0%Standard0.01400.356
3.86
0.0068
3.83
0.0074
3.81
0.0083
3.80
0.0086
3.78
0.0090
3.78
0.0089
3x165245.0%Standard0.01600.406
3.95
0.0066
3.92
0.0072
3.91
0.0080
3.90
0.0083
3.89
0.0086
3.88
0.0085
3x165250.0%Standard0.01800.457
3.82
0.0068
3.81
0.0075
3.80
0.0083
3.79
0.0086
3.78
0.0091
3.76
0.0089
2x2116/2x165246.0%Alternate0.01900.483
3.92
0.0066
3.90
0.0073
3.89
0.0081
3.87
0.0089
3.86
0.0087
3.85
0.0086
2x2116/2x165247.0%Alternate0.02000.508
3.89
0.0067
3.88
0.0074
3.87
0.0083
3.85
0.0085
3.84
0.0089
3.83
0.0088
2x2116/2x165250.0%Alternate0.02100.533
3.82
0.0068
3.81
0.0075
3.80
0.0083
3.79
0.0086
3.78
0.0091
3.76
0.0089
2x2116/3x165252.0%Alternate0.02800.711
3.77
0.0073
3.76
0.0080
3.76
0.0088
3.75
0.0091
3.73
0.0093
3.73
0.0093

Prepreg Data

ConstructionResin Content %Standard/AlternateThickness (inch)Thickness (mm)Dielectric Constant (DK) / Dissipation Factor (DF)
100 MHz500 MHz1 GHz2 GHz5 GHz10 GHz
10670.0%Standard0.00190.048
3.40
0.008
3.38
0.009
3.36
0.010
3.34
0.010
3.32
0.011
3.31
0.011
10675.0%Standard0.00230.058
3.30
0.008
3.27
0.009
3.26
0.010
3.23
0.011
3.22
0.011
3.22
0.011
106769.0%Std/Spread0.00230.058
3.42
0.008
3.40
0.008
3.38
0.010
3.36
0.010
3.34
0.011
3.33
0.010
106773.0%Std/Spread0.00270.069
3.33
0.008
3.32
0.009
3.30
0.010
3.28
0.010
3.26
0.011
3.26
0.011
108662.0%Standard0.00320.081
3.55
0.007
3.54
0.008
3.52
0.009
3.50
0.010
3.48
0.010
3.48
0.010
108065.0%Standard0.00320.081
3.50
0.007
3.49
0.008
3.46
0.009
3.44
0.010
3.42
0.010
3.42
0.010
108665.0%Std/Spread0.00350.089
3.50
0.007
3.49
0.008
3.46
0.009
3.44
0.010
3.42
0.010
3.42
0.010
108071.0%Standard0.00400.102
3.37
0.008
3.36
0.009
3.34
0.010
3.32
0.010
3.30
0.011
3.30
0.011
231356.0%Standard0.00400.102
3.70
0.007
3.67
0.008
3.65
0.009
3.64
0.009
3.63
0.010
3.62
0.010
331357.0%
Alternate
0.00400.102
3.67
0.007
3.64
0.008
3.62
0.009
3.61
0.009
3.60
0.010
3.59
0.010
211357.0%
Standard
0.00410.104
3.67
0.007
3.64
0.008
3.62
0.009
3.61
0.009
3.60
0.010
3.59
0.010
331359.0%Standard0.00420.107
3.63
0.007
3.61
0.008
3.58
0.009
3.57
0.009
3.55
0.010
3.54
0.010
211655.0%Standard0.00490.124
3.72
0.007
3.70
0.008
3.68
0.009
3.66
0.009
3.65
0.010
3.65
0.009
211658.0%Alternate0.00540.137
3.65
0.007
3.63
0.008
3.60
0.009
3.59
0.009
3.57
0.010
3.56
0.010
NOTE
Revisions:
A-Original-4/17
B-Added Standard & Alternate construction-8/18
C-Remove Low Dk glass options
Standard-Commonly available with the best availability.
Alternate-Available, but not stocked with longer lead time
11/26/2018
10/17/2012

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PCB Material Selection for High-speed Digital Designs (Presentation)

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