Tachyon® 100G
Ultra Low Loss Laminate and Prepreg
Tachyon 100G laminate materials are designed for very high-speed digital applications up to and beyond data rates of 100 Gb/s.
Thermal Performance
Td: 360°C
Electrical Performance
Df: 0.0021
Tachyon 100G materials exhibit exceptional electrical properties that are very stable over a broad frequency and temperature range between -55°C and +125°C up to 100 GHz. These electrical properties provide designers a scalable solution for next generation designs of backplanes and daughter cards, enabling 10x improvements from 10 Gb/s data rates.
Isola has developed Tachyon 100G with the highest level of thermal performance for high layer count line cards. The very low Z-axis CTE makes it a perfect choice for fine pitch BGA applications of 0.8 mm or less. The material is optimized with the use of spread glass to mitigate skew, improve rise times, reduce jitter, and increase eye width/height and that use ultra smooth HVLP (VLP2) 2um Rz copper that significantly reduces conductor losses.
Attributes
Markets
Product Features
- Industry Recognition
- UL File Number: E41625
- RoHS Compliant
- Performance Attributes
- CAF resistant
- Low moisture absorption
- 0.8 mm pitch capable
- 6x 260°C reflow capable
- 6x 288°C solder float capable
- Processing Advantages
- Multiple lamination cycles
- HDI technology compatible
Production & Manufacturing
Currently manufactured in Asia, North America
Product Availability
- Standard Material Offering: Laminate
- 2 to 20 mil (0.05 to 0.51 mm)
- Copper Foil Type
- HVLP3 (VLP1) ≤1.1 micron Rz JIS
- HVLP (VLP2) ≤2.5 micron Rz JIS
- Advanced RTF ≤2.5 micron Rz JIS
- Embedded resistor foil
- Copper Weight
- ½, 1 and 2 oz (18, 35 and 70 µm) available
- Heavier copper foil available
- Thinner copper foil available
- Standard Material Offering: Prepreg
- Tooling of prepreg panels
- Moisture barrier packaging
- Glass Fabric Availability
- Low Dk Glass -Asahi Japan, Asahi Tawian, TGI Taiwan
- Square weave glass
- Mechanically spread glass
| Property | Typical Value | Units | Test Method | |
|---|---|---|---|---|
| Metric (English) | IPC-TM-650 (or as noted) | |||
| Glass Transition Temperature (Tg) by DSC | 215 | °C | 2.4.25C | |
| Glass Transition Temperature (Tg) by DMA | 230 | °C | 2.4.24.4 | |
| Glass Transition Temperature (Tg) by TMA | 210 | °C | 2.4.24C | |
| Decomposition Temperature (Td) by TGA @ 5% weight loss | 360 | °C | 2.4.24.6 | |
| Time to Delaminate by TMA (Copper removed) |
A. T260 B. T288 C. T300
|
>60 >60 >20
|
Minutes | 2.4.24.1 |
| Z-Axis CTE |
A. Pre-Tg B. Post-Tg C. 50 to 260°C, (Total Expansion)
|
45 250 2.5
|
ppm/°C ppm/°C %
|
2.4.24C |
| X/Y-Axis CTE | Pre-Tg | 15 | ppm/°C | 2.4.24C |
| Thermal Conductivity | 0.42 | W/m·K | ASTM E1952 | |
| Thermal Stress 10 sec @ 288ºC (550.4ºF) |
A. Unetched B. Etched
|
Pass | Pass Visual | 2.4.13.1 |
| Dk, Permittivity |
A. @ 2 GHz B. @ 5 GHz C. @ 10 GHz
|
3.04 3.02 3.02
|
— | 2.5.5.5 |
| Df, Loss Tangent |
A. @ 2 GHz B. @ 5 GHz C. @ 10 GHz
|
0.0021 | — | 2.5.5.5 |
| Volume Resistivity | C-96/35/90 | 1.33x107 | MΩ-cm | 2.5.17.1 |
| Surface Resistivity | C-96/35/90 | 1.33x105 | MΩ | 2.5.17.1 |
| Dielectric Breakdown | 60 | kV | 2.5.6B | |
| Arc Resistance | 125 | Seconds | 2.5.1B | |
| Electric Strength (Laminate & laminated prepreg) | 60 (1500) | kV/mm (V/mil) | 2.5.6.2A | |
| Comparative Tracking Index (CTI) | 3 (175 -249) | Class (Volts) |
UL 746A ASTM D3638 |
|
| Peel Strength |
A. Low profile and very low profile copper foil B. Low profile and very low profile copper foil ... After thermal stress
|
0.79 (4.5) 0.96 (5.5) |
N/mm (lb/inch) |
2.4.8C 2.4.8.2A |
| Flexural Strength |
A. Length direction B. Cross direction
|
303 (44.0) 283 (41.0)
|
MPa (kpsi) | 2.4.4B |
| Tensile Strength |
A. Length direction B. Cross direction
|
207 (30.0) 172 (25.0)
|
MPa (kpsi) | ASTM D3039 |
| Young's Modulus |
A. Length direction B. Cross direction
|
2,551 2,417
|
ksi | ASTM D790-15e2 |
| Taylor's Modulus |
A. Length direction B. Cross direction
|
2,264 2,197
|
ksi | ASTM D790-15e2 |
| Poisson's Ratio |
A. Length direction B. Cross direction
|
0.165 0.156
|
— | ASTM D3039 |
| Moisture Absorption | 0.1 | % | 2.6.2.1A | |
| Flammability (Laminate & laminated prepreg) | V-0 | Rating | UL 94 | |
| Relative Thermal Index (RTI) | 130 | °C | UL 746 | |
| The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold. | ||||
NOTE
Visit our site http://www.isola-group.com for more details.
Revisions:
A: Initial release - 4/17
B: Corrected moisture uptake value 6/18
C: Corrected units for Flexural and Tensile Strength - 8/18
D: Change MOT to RTI - 5/19
E: Changed VLP2 to HVLP to aligned with common industry terms 4/21
F: Changed TMA Tg to 210C, DSC Tg to 215C and DMA to 230C based on long term data 9/22
G: Added HVLP3, Advanced RTF and 2 ounce copper options, added 20 mil thickness option - 3/24
Core Data
| Construction | Resin Content % | Offering | Thickness (inch) | Thickness (mm) | Dielectric Constant (DK)/ Dissipation Factor (DF) | |||||
|---|---|---|---|---|---|---|---|---|---|---|
| 1 GHz | 2 Ghz | 5 Ghz | 10 GHz | 15 Ghz | 20 Ghz | |||||
| 1x1067 | 66.5% | Standard | 0.0020 | 0.051 | 3.05 0.0017 |
3.05 0.0017 |
3.05 0.0017 |
3.05 0.0017 |
3.05 0.0017 |
3.05 0.0017 |
| 1x1035 | 73.5% | Standard | 0.0025 | 0.064 | 2.97 0.0014 |
2.97 0.0014 |
2.97 0.0014 |
2.97 0.0014 |
2.97 0.0014 |
2.97 0.0014 |
| 1x1078 | 66.0% | Standard | 0.0030 | 0.076 | 3.09 0.0018 |
3.09 0.0018 |
3.09 0.0018 |
3.09 0.0018 |
3.09 0.0018 |
3.09 0.0018 |
| 1x1078 | 70.5% | Standard | 0.0035 | 0.089 | 3.02 0.0015 |
3.02 0.0016 |
3.02 0.0016 |
3.02 0.0016 |
3.02 0.0016 |
3.01 0.0016 |
| 2x1035 | 67.5% | Alternate | 0.0040 | 0.102 | 3.07 0.0017 |
3.07 0.0017 |
3.07 0.0017 |
3.07 0.0017 |
3.07 0.0017 |
3.07 0.0017 |
| 1x3313 | 58.5% | Standard | 0.0040 | 0.102 | 3.24 0.0022 |
3.24 0.0022 |
3.24 0.0022 |
3.24 0.0022 |
3.24 0.0022 |
3.24 0.0022 |
| 2x1067 | 66.5% | Standard | 0.0040 | 0.102 | 3.05 0.0017 |
3.05 0.0017 |
3.05 0.0017 |
3.05 0.0017 |
3.05 0.0017 |
3.05 0.0017 |
| 2x1067 | 70.0% | Standard | 0.0045 | 0.114 | 3.02 0.0016 |
3.02 0.0016 |
3.02 0.0016 |
3.02 0.0016 |
3.02 0.0016 |
3.02 0.0016 |
| 2x1078 | 60.0% | Standard | 0.0050 | 0.127 | 3.19 0.0021 |
3.19 0.0021 |
3.19 0.0021 |
3.19 0.0021 |
3.19 0.0021 |
3.19 0.0021 |
| 1x3313 | 66.0% | Alternate | 0.0050 | 0.127 | 3.11 0.0018 |
3.11 0.0018 |
3.11 0.0018 |
3.11 0.0018 |
3.11 0.0018 |
3.11 0.0018 |
| 2x1067 | 72.5% | Standard | 0.0050 | 0.127 | 2.98 0.0014 |
2.98 0.0014 |
2.98 0.0015 |
2.98 0.0015 |
2.98 0.0015 |
2.98 0.0015 |
| 2x1078 | 66.0% | Standard | 0.0060 | 0.152 | 3.09 0.0018 |
3.09 0.0018 |
3.09 0.0018 |
3.09 0.0018 |
3.09 0.0018 |
3.09 0.0018 |
| 2x1078 | 70.5% | Standard | 0.0070 | 0.178 | 3.02 0.0015 |
3.02 0.0016 |
3.02 0.0016 |
3.02 0.0016 |
3.02 0.0016 |
3.01 0.0016 |
| 2x3313 | 58.5% | Standard | 0.0080 | 0.203 | 3.24 0.0022 |
3.24 0.0022 |
3.24 0.0022 |
3.24 0.0022 |
3.24 0.0022 |
3.24 0.0022 |
| 2x3313 | 63.5% | Alternate | 0.0090 | 0.229 | 3.16 0.0020 |
3.16 0.0020 |
3.16 0.0020 |
3.16 0.0020 |
3.16 0.0020 |
3.16 0.0020 |
| 3x1078 | 68.5% | Standard | 0.0100 | 0.254 | 3.04 0.0016 |
3.04 0.0016 |
3.04 0.0016 |
3.04 0.0016 |
3.04 0.0016 |
3.04 0.0016 |
| 2x3313 | 66.0% | Alternate | 0.0100 | 0.254 | 3.11 0.0018 |
3.11 0.0018 |
3.11 0.0018 |
3.11 0.0018 |
3.11 0.0018 |
3.11 0.0018 |
| 3x3313 | 58.5% | Standard | 0.0120 | 0.305 | 3.24 0.0022 |
3.24 0.0022 |
3.24 0.0022 |
3.24 0.0022 |
3.24 0.0022 |
3.24 0.0022 |
| 2x3313/1078 | 66.5% | Alternate | 0.0133 | 0.338 | 3.10 0.0018 |
3.10 0.0018 |
3.10 0.0018 |
3.10 0.0018 |
3.10 0.0018 |
3.10 0.0018 |
| 3x3313 | 62.5% | Standard | 0.0140 | 0.356 | 3.15 0.0020 |
3.15 0.0020 |
3.15 0.0020 |
3.15 0.0020 |
3.15 0.0020 |
3.15 0.0020 |
| 4x2116 | 57.0% | Standard | 0.0200 | 0.508 | 3.25 0.0022 |
3.25 0.0022 |
3.25 0.0022 |
3.25 0.0022 |
3.25 0.0022 |
3.25 0.0022 |
Prepreg Data
| Glass Style | Resin Content % | Offering | Thickness (inch) | Thickness (mm) | Dielectric Constant (DK)/ Dissipation Factor (DF) | |||||
|---|---|---|---|---|---|---|---|---|---|---|
| 1 GHz | 2 Ghz | 5 Ghz | 10 GHz | 15 Ghz | 20 Ghz | |||||
| 1035 | 69.0% | Standard | 0.002 | 0.051 | 3.06 0.0017 |
3.06 0.0017 |
3.06 0.0017 |
3.06 0.0017 |
3.06 0.0017 |
3.06 0.0017 |
| 1067 | 70.0% | Standard | 0.0022 | 0.056 | 3.05 0.0017 |
3.05 0.0017 |
3.05 0.0017 |
3.05 0.0017 |
3.05 0.0017 |
3.05 0.0017 |
| 106 | 76.0% | Standard | 0.0023 | 0.058 | 2.95 0.0013 |
2.95 0.0013 |
2.95 0.0014 |
2.95 0.0014 |
2.95 0.0014 |
2.95 0.0014 |
| 1067 | 71.5% | Standard | 0.0024 | 0.061 | 3.02 0.0016 |
3.02 0.0016 |
3.02 0.0016 |
3.02 0.0016 |
3.02 0.0016 |
3.02 0.0016 |
| 1035 | 75.0% | Standard | 0.0026 | 0.066 | 2.97 0.0014 |
2.97 0.0014 |
2.97 0.0014 |
2.97 0.0014 |
2.97 0.0014 |
2.97 0.0014 |
| 1067 | 74.0% | Standard | 0.0026 | 0.066 | 2.98 0.0014 |
2.98 0.0014 |
2.98 0.0015 |
2.98 0.0015 |
2.98 0.0015 |
2.98 0.0015 |
| 1067 | 76.5% | Standard | 0.0029 | 0.074 | 2.94 0.0013 |
2.94 0.0013 |
2.94 0.0013 |
2.94 0.0013 |
2.94 0.0013 |
2.94 0.0013 |
| 1078 | 65.0% | Standard | 0.0029 | 0.074 | 3.14 0.0019 |
3.14 0.0019 |
3.14 0.0019 |
3.14 0.0019 |
3.14 0.0019 |
3.14 0.0019 |
| 1078 | 67.5% | Standard | 0.0031 | 0.079 | 3.09 0.0018 |
3.09 0.0018 |
3.09 0.0018 |
3.09 0.0018 |
3.09 0.0018 |
3.09 0.0018 |
| 1078 | 70.5% | Standard | 0.0035 | 0.089 | 3.04 0.0016 |
3.04 0.0016 |
3.04 0.0016 |
3.04 0.0016 |
3.04 0.0016 |
3.04 0.0016 |
| 1078 | 72.0% | Standard | 0.0037 | 0.094 | 3.02 0.0015 |
3.02 0.0016 |
3.02 0.0016 |
3.02 0.0016 |
3.02 0.0016 |
3.01 0.0016 |
| 1080 | 72.0% | Standard | 0.0038 | 0.097 | 3.02 0.0015 |
3.02 0.0016 |
3.02 0.0016 |
3.02 0.0016 |
3.02 0.0016 |
3.01 0.0016 |
| 1078 | 75.0% | Standard | 0.0042 | 0.107 | 2.97 0.0014 |
2.97 0.0014 |
2.97 0.0014 |
2.97 0.0014 |
2.97 0.0014 |
2.97 0.0014 |
| 1080 | 75.0% | Standard | 0.0043 | 0.109 | 2.97 0.0014 |
2.97 0.0014 |
2.97 0.0014 |
2.97 0.0014 |
2.97 0.0014 |
2.97 0.0014 |
| 1080 | 78.0% | Alternate | 0.0046 | 0.117 | 2.92 0.0013 |
2.92 0.0013 |
2.92 0.0014 |
2.92 0.0014 |
2.92 0.0014 |
2.92 0.0014 |
| 1078 | 78.0% | Alternate | 0.0046 | 0.117 | 2.92 0.0013 |
2.92 0.0013 |
2.92 0.0014 |
2.92 0.0014 |
2.92 0.0014 |
2.92 0.0014 |
| 3313 | 63.5% | Standard | 0.0046 | 0.117 | 3.16 0.0020 |
3.16 0.0020 |
3.16 0.0020 |
3.16 0.0020 |
3.16 0.0020 |
3.16 0.0020 |
| 3313 | 66.5% | Standard | 0.0051 | 0.129 | 3.11 0.0018 |
3.11 0.0018 |
3.11 0.0018 |
3.11 0.0018 |
3.11 0.0018 |
3.11 0.0018 |
| 2116 | 62.0% | Standard | 0.0058 | 0.147 | 3.19 0.0021 |
3.19 0.0021 |
3.19 0.0021 |
3.19 0.0021 |
3.19 0.0021 |
3.19 0.0021 |
| 2116 | 65.0% | Alternate | 0.0064 | 0.163 | 3.14 0.0019 |
3.14 0.0019 |
3.14 0.0019 |
3.14 0.0019 |
3.14 0.0019 |
3.14 0.0019 |
NOTE
Revisions:
A - Original-4/17
B - Adjusted prepreg thickness values-6/18
C - Added Standard & Alternate construction-8/18;
D - Added 9 mil core 5/19
E - Optimized construction set 6/19
F - Clarified Weave and Offering, eliminated low Frequency data 1/20
G - Removed Weave Type 9/20
All Tachyon 100G glass is Spread Weave in both directions
Standard-Commonly available; Alternate-Available, but not stocked
| Resource Title & Summary | Date Updated |
|---|---|
| Tachyon100G Prepreg Supplemental | 03/20/2024 |
| Tachyon® 100G Laminate Supplemental | 03/20/2024 |
| Isola Laminate Outgassing Data Properties | 03/22/2024 |
| Tachyon® 100G Processing Guide | 01/20/2023 |
| Tachyon® 100G Laminate Safety Data Sheet | 01/22/2024 |
| Tachyon® 100G Prepreg Safety Data Sheet | 01/22/2024 |
| Tachyon® 100G Laminate RoHS Declaration | 03/20/2024 |
| Tachyon® 100G Prepreg RoHS Declaration | 03/20/2024 |
Resources
Anisotropic Design Considerations for 28 Gbps Via to Stripline Transitions
This paper discusses how for 28-56 Gb/s design the homogeneous isotropic material assumption is a key impediment in model to measurement correlation.
Quantifying Timing Skew In Differential Signaling using Practical Fiber Weave Model
This presentation outlines practical fiber weave effect model for skew and jitter.
PCB Material Selection for High-speed Digital Designs
This presentation describes PCB factors that limit high-speed digital performance and the PCB material selection process and Isola product solutions.
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