High Thermal Reliability
Thermal reliability requirements can be separated into two categories. The first involves survival of a PCB through assembly without defects such as blisters or delamination. The second category involves thermal reliability in the operating environment over a product’s lifetime. Both types of thermal reliability are critical.
While excellent thermal reliability through assembly has always been important, the advent of lead-free assembly has required further enhancements to printed circuit materials in recent years due to the higher assembly temperatures required. In addition, many products that have had exemptions for lead-free assembly will need to convert to lead-free assembly in the near future. Often, these are the more complex PCB designs where thermal requirements are already demanding.
Beyond lead-free assembly, applications where PCBs are exposed to harsh operating environments also require thermally robust materials. Isola offers several products with different levels of electrical performance that all possess excellent thermal reliability.
- High glass transition temperature, Tg
- Low CTE
- High decomposition temperature, Td
- Low moisture absorption
- High time to delamination, T-260 & T-288
- Ease of manufacturing
- Global availability & technical support
- Lead-free assembly
- Sequential lamination
- Down-well drilling
- Telecommunications & Network Infrastructure
- High-speed computing
|I-Tera® MT40 (RF/MW)||N/A||200||360||3.38 / 3.45 / 3.60 / 3.75||0.0028 - 0.0035|
Webinars, Videos & Articles
This paper discusses how new thermoset resins are emerging as a viable alternative for advanced automotive safety systems by offering cost and reliability advantages over
This paper examines the thermal reliability of microvias and standard vias in relation to the materials and processes in which by they are created.
This presentation discusses thermal management considerations for embedded systems.
This paper discusses how for 28-56 Gb/s design the homogeneous isotropic material assumption is a key impediment in model to measurement correlation.
This application note discusses how Differential Scanning Calorimetry (DSC) measures the flow of heat into or out of a sample compared to a reference.