High Thermal Reliability

Car Electronic

Thermal reliability requirements can be separated into two categories. The first involves survival of a PCB through assembly without defects such as blisters or delamination. The second category involves thermal reliability in the operating environment over a product’s lifetime. Both types of thermal reliability are critical.

While excellent thermal reliability through assembly has always been important, the advent of lead-free assembly has required further enhancements to printed circuit materials in recent years due to the higher assembly temperatures required. In addition, many products that have had exemptions for lead-free assembly will need to convert to lead-free assembly in the near future. Often, these are the more complex PCB designs where thermal requirements are already demanding.

Beyond lead-free assembly, applications where PCBs are exposed to harsh operating environments also require thermally robust materials. Isola offers several products with different levels of electrical performance that all possess excellent thermal reliability.


  • High glass transition temperature, Tg
  • Low CTE
  • High decomposition temperature, Td
  • Low moisture absorption
  • High time to delamination, T-260 & T-288
  • Ease of manufacturing
  • Global availability & technical support
Typical Applications:

  • Lead-free assembly
  • Sequential lamination
  • Automotive
  • Aerospace
  • Military
  • Down-well drilling
  • Telecommunications & Network Infrastructure
  • High-speed computing
ProductCTE Z-axisTg
by TMA
Tachyon® 100G2.52003603.020.0021
TerraGreen® (RF/MW)N/A2003903.450.0032
I-Tera® MT40 (RF/MW)N/A2003603.38 / 3.45 / 3.60 / 3.750.0028 - 0.0035
Astra® MT77N/A2003603.000.0017
I-Tera® MT402.82003603.450.0031

Webinars, Videos & Articles

Thermosets' Cost and Reliability Advantages for Automotive Radar PCBs (White Paper)

This paper discusses how new thermoset resins are emerging as a viable alternative for advanced automotive safety systems by offering cost and reliability advantages over

Thermal Reliability of Laser Ablated Microvias and Standard Through-Hole Technologies as a Function of Materials and Processing (Technical Paper)

This paper examines the thermal reliability of microvias and standard vias in relation to the materials and processes in which by they are created.

Thermal Management of PCBs in Embedded Systems (Presentation)

This presentation discusses thermal management considerations for embedded systems.

Anisotropic Design Considerations for 28 Gbps Via to Stripline Transitions (Technical Paper)

This paper discusses how for 28-56 Gb/s design the homogeneous isotropic material assumption is a key impediment in model to measurement correlation.

Understanding Glass Transition Temperature Measurements of Printed Circuit Boards by DSC (Application Note)

This application note discusses how Differential Scanning Calorimetry (DSC) measures the flow of heat into or out of a sample compared to a reference.